Here're my predictions for 10th-gen. Starting with Microsoft; I'll post the Sony one tomorrow.
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[MICROSOFT XBOX SERIES Z/SURFACE Z]
>Stronger approach towards a PC-like modular design specification (Series Z)
>Future-proofed design with upclockable CPU
>Custom-built GPU card that is upgradable
>No standard VR or AR headset device included; compatible with helmets from
several brands, including Samsung and HTC
>Additional SKU could be provided with an included headset at a higher price point
>Positioned in marketing as a next-gen gaming, productivity & business high-end laptop
device (Surface Z.D)
>Two models; Series Z and Surface Z.D
>Series Z uses Xbox OS & has scaled-down port interface counts & some
reduced feature support. Sold at traditional loss-leading model
>Surface Z.D uses Windows Next Home OS & has expanded port interface*, slots, &
some additional QoL feature support. Sold at profit
* = Some of this via Docking Bay expansion module; MOTL
>Surface Z is intended for productivity, gaming and business work tasks,
while having same specs as Series Z
>Both utilize same default CPU, GPU, audio, SSD, RAM configurations
>Surface Z.D is a laptop-style device similar to Surface Book 3, but provided
in a single configuration with same processor and RAM components as Series Z.
However, Surface Z.D operates in two modes: Portable and Docked.
>Portable Mode uses it as a laptop, and the CPU & GPU clocks are lowered
to consume less power and provide suitable battery life.
>Docked Mode connects the Surface Z.D to a Docking Bay, with a special
cooling pass-through compartment that connects to a portion of the Surface
Z.D when a piece of the unit is removed, providing additional cooling
and thermal control. This allows the Surface Z.D to operate at full
clocks, i.e same clocks as Series Z's CPU & GPU. It's recommended to
keep the Series Z.D connected for charge via AC mode for this.
>The Docking Bay for Surface Z.D is not included in the default configuration,
but is included in another configuration for an additional fee. Surface Z.D
does not need the Docking Bay in order to function.
>The Docking Bay includes four additional PCIe slots, which the Surface Z.D
can use to address additional peripherals. This leverages use of a system
bus extension.
>Surface Z.D comes with a high-quality 17" AMOLED 6K display touchscreen
with up to 300 Hz refresh rate
>Both provide support for Optane-style "M.NVRAM" form-factor persistent storage,
PCIe 6.0-CXL links, 2 per slot (16 GB/s per slot), 2x slots
>Series Z does not come with included persistent memory storage. Can
support 2x 16 GB/s M.NVRAM cards (one per slot), 256 GB capacity each, for
512 GB @ 32 GB/s.
>Surface Z.D comes with 128 GB of Micron 3D X-point persistent memory as
2x 12 GB/s M.NVRAM cards providing 24 GB/s bandwidth. Can support 2x 16 GB/s
M.NVRAM cards (one per slot), 512 GB capacity each, for 1 TB @ 32 GB/s.
>Series Z supports 3P GPUs. However, the Series Z is only compatible
with a limited range of specific GPUs from Microsoft/AMD meant for the Z. Specific
GPUs will be made available at a later date; may require change of modular PSU.
Surface Z.D does not support any 3P GPUs, as its GPU is soldered onto the motherboard
and integrated into the package design.
>Series Z supports BIOS-level safe detection feature; the system is rated for installation
of specific peripheral components in PCIe slots that fall within a given power profile.
Devices exceeding this will not be authorized installation. CPU upclocking only
permitted at BIOS level, only on detection of new installed GPU. GPU installation
requires power to be off, also requires PSU replacement (PSU comes with GPU package).
If GPU is removed when power on, system shuts down and if new GPU is installed and
system turned on, system detects as unauthorized change and shuts down unless previous
GPU and PSU are reinstalled.
>Implementation of advanced SAM/BAR addressing scheme enforced through custom block that
handles data coherency and transfer of info from storage, NVRAM, GPU and CPU memory pools.
Hardware bandwidth limit of 80 GB/s
>NAND decompression I/O built into custom data management block. Supports 4:1 decompression ratio.
>Custom data management block supports ringbus arbitration to allow CPU, GPU, audio to share
access to storage and NVRAM
[CPU]
>CORES: 16
>THREADS: 32
>CLOCK: 5.4 GHz
>L1$: 64 KB (per core), 1 MB (total)
>L2$: 1 MB (per core), 16 MB (total)
>L3$: 16 MB (all)
>SOCKET: N/A (embedded CPU)
**Series Z-X CPU socket only supports default CPU processor; upclock
possible only when new Microsoft/AMD GPU/PSU package authorized install.
Clock increase range varies depending on newly installed GPU/PSU metrics.
[GPU]
>ARCHITECTURE: RDNA
>GENERATION: 7
>PROCESS: N3P
>CONFIG: Chiplet
>SHADER ENGINES: 2
>SHADER ARRAYS (per SE): 4 (HSE-1), 2 (HSE-2)
>COMPUTE UNITS: 80
>HSE-1: 56 CUs (4x Dual 7 CU SAs)
>HSE-2: 24 CUs (2x Dual 6 CU SAs)
>COMPUTE UNIT CONFIGURATION: Dual CU
>SHADER CORES (PER CU): 96
>SHADER CORES (TOTAL): 7680
>ROPs: 128
[* = In Series Z, both HSEs technically have 64 ROPs; however there
is additional logic built into the GPU allowing HSE-1 to use one
of the 32 ROP banks in HSE-2 as if it were a 3rd 32-block ROP bank.]
>TMUs: 6 (per CU), 480 (total)
>ALUs/SHADER UNITS: 7680
>STATE MODES (IF ANY): 4; FULL (80 CUs), HSE-1 (56 CUs), HSE-2 (24 CUs), DUAL-HALF (56 HSE-1, 24 HSE-2)
>CLOCK FREQUENCIES: 2723 MHz (FULL), 4291.388 MHz (HALF-SE 1), 4522.4968 MHz (HALF-SE 2), 2723 MHz (DUAL-HALF)
>IPC: 2
>IPS: 4875.92 million IPS (FULL), 8206.964 million IPS (HALF-SE 1), 9044.9936 million IPS (HALF-SE 2), 4875.92 million IPS (DUAL-HALF)
>THEORETICAL FLOATING POINT OPERATIONS PER SECOND: 41.825 TF (FULL), 46.141 TF (HSE-1), 20.839 TF (HSE-2), 41.825 TF (DUAL-HALF)
># PRIM UNITS: 4 (2 each SE, 1 each SA)
># PRIMs/CLOCK PER UNIT: 4
># TRI RAS/CLOCK PER UNIT: 2
>PRIMITIVES PER CLOCK: 16
>TRIANGLES PER CLOCK: 8
>GEOMETRY CULLING RATE: 43.568 billion (FULL), 34.331 billion (HSE-1), 36.179 billion (HSE-2), 43.568 billion (DUAL-HALF)
>TRIANGLE RASTERIZATION RATE: 21.784 billion (FULL), 17.1655 billion (HSE-1), 18 billion (HSE-2), 21.784 billion (DUAL-HALF)
>PIXEL FILL RATE: 348.544 Gpixels/s (FULL), 411.973 Gpixels/s (HALF HE-1), 289.439 Gpixels/s (HALF-HE 2), 348.544 Gpixels/s (DUAL-HALF)*
* = 261.408 Gpixels/s (HSE-1, 96 ROPs), 87.136 Gpixels/s (HSE-2 32 ROPs), or:
* = 174.272 Gpixels/s (HSE-1, 64 ROPs), 174.272 Gpixels/s (HSE-2, 64 ROPs)
>TEXTURE FILL RATE: 1307.04 Gtexels/s (FULL), 1441.906 Gtexels/s (HALF SE-1), 651.239 Gtexels/s (HALF-SE-2), 1307.04 Gtexels/s (DUAL-HALF)*
* = 914.928 Gtexels/s (SE1), 392.112 Gtexels/s (SE2)
>THREAD DEPLOYMENT RATE: 81,920 (FULL), 57,344 (HSE-1), 24,576 (HSE-2), 81,920 (DUAL-HALF)
>CACHE CAPACITY:
>L0$: 16 KB per CU (1.152 MB total)
>L1$: 64 KB per dual-CU/WGP (2.304 MB total)
>L2$: 512 KB per Array (2 MB total)
>L3$: 64 MB
>TOTAL: 69.456 MB
>CACHE BANDWIDTH:
>L0$: 41.4 TB/s (FULL), 45.679 TB/s (HALF SE-1), 20.63 TB/s (HALF SE-2), 41.4 TB/s (DUAL-HALF)*
* = 28.98 TB/s (HSE-1), 12.42 TB/s (HSE-2)
>L1$: 28.98 TB/s (FULL), 31.975 TB/s (HALF SE-1), 12.42 TB/s (HALF-SE-2), 28.98 TB/s (DUAL-HALF) (L0$ * .70)
>L2$: 17.388 TB/s (FULL), 19.185 TB/s (HALF SE-1), 7.452 TB/s (HALF SE-2), 17.388 TB/s (DUAL-HALF) (L1$ * .60)
>L3$: 8.694 TB/s (FULL), 9.592 TB/s (HALF SE-1), 3.76 TB/s (HALF SE-2), 8.694 TB/s (DUAL-HALF) (L1$ * .30)
>TOTAL: 96.462 TB/s (FULL), 106.431 TB/s (HALF SE-1), 44.262 TB/s (HALF SE-2), 96.462 TB/s (DUAL-HALF)
...2nd half below...