Yay! It's real!
My guesses...
Motherboard on the bottom, they claimed some space removing airflow under the board, which means GDDR5 must be on the the same side as the soc now (so all pointing up). No need for the previous embossed shielding allowing any flow on that side anymore, making it slimmer just by that side.
Board might be clearing the ODD this time.
If thet kept the very sparse power supply components, it allows low flow because it can have a high outlet temperature.
I have a thing for high static pressure, low flow designs. It's efficient. Means compact and very tight fins heat sink.
Fan intakes must still be the entire left and right sides, in addition to the front side this time. Laminar flow would still cool the top side, bottom heat will convect toward the top.
Outlet still have to be on the back. The inset increases the effective area, at least compensates the structural separators. High static presure makes this a non issue.
Bottom and back vent will be hot, people will once again jump to conclusion using a FLIR gun without understanding shit.
The fan will probably have changed to be mostly single sided inlet instead of simultaneous top and bottom. But overall flow would be less anyway if it's 14nm. Wild guess is +3 to +6db from single inlet air speed, -6 to -12db from lower rpm and lower tip velocity turbulence.
.. It's possible everything I said is random bulshit. Or everything is correct and well thought out.