Sony Playstation Meeting September 7 2016 [PS4 Slim, PS4 Pro, Rumors, Speculations, and News]

But did you sell your PS3??

2nve36a.jpg
 
Nice!
Metal frame would be 39mm x 39mm (using the the battery from the other image)

12.8 x 15.9 = 203 mm2

How does this compare to XB1S ?

OG One 363 mm^2
One S 240 mm^2

OG PS4 348 mm^2
Slim ~194-203 mm^2

Could it be Sony have been able to remove the extra 2 CUs for redundancy? It seems like the shrink is quite a bit more of a percentage than the One S?
 
OG One 363 mm^2
One S 240 mm^2

OG PS4 348 mm^2
Slim ~194-203 mm^2

Could it be Sony have been able to remove the extra 2 CUs for redundancy? It seems like the shrink is quite a bit more of a percentage than the One S?
Without knowing the node size, we are left to speculate unfortunately. XBOS is 16nm. The Slim could be smaller.


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It seems they even have removed RGB led and installed blue, red and yellow leds I think.
Also note this little board comes from the end of motherboard :D
post-78495-0-70907300q5orh.jpg
 
Without knowing the node size, we are left to speculate unfortunately. XBOS is 16nm. The Slim could be smaller.


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There's nothing smaller, 14nm is essentially the same size as 16nm (which Apple dual sourced).

MS have new stuff for 4K decoding, maybe the new UVD block needs much more area?
Maybe the CUs are a different design which is more space efficient, so the majority of the space being from the CUs would give an advantage to PS4S?
Differences between DDR3 and GDDR5 controllers?
SHAPE, and/or tensilica cores, and/or esram not shrinking well?
 
If they have an enclosure larger than the standard PS4, my guess is that the PSNEO will be highly overclocked to the standard speed of an AMD 480. All they would have to do is add a better fan and make the power brick slightly larger.
 
So both MS and Sony went for 16nm FF+ TSMC, interesting. Wonder if this'll stay the same for Neo/Scorpio.
There's nothing smaller, 14nm is essentially the same size as 16nm (which Apple dual sourced).

MS have new stuff for 4K decoding, maybe the new UVD block needs much more area?
Maybe the CUs are a different design which is more space efficient, so the majority of the space being from the CUs would give an advantage to PS4S?
Differences between DDR3 and GDDR5 controllers?
SHAPE, and/or tensilica cores, and/or esram not shrinking well?

ESRAM could also be the culprit
 
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It seems they even have removed RGB led and installed blue, red and yellow leds I think.
Also note this little board comes from the end of motherboard :D
post-78495-0-70907300q5orh.jpg

this board with two buttons(power/eject), piezo beeper and leds is from the corner of the PS4 slim, sits under BD drive intake and is connected with the motherboard via flat cable

 
this board with two buttons(power/eject), piezo beeper and leds is from the corner of the PS4 slim, sits under BD drive intake and is connected with the motherboard via flat cable

mmbbmlqer.jpg


It's likely have been assembled as 1 piece and tore apart later.
 
It's likely have been assembled as 1 piece and tore apart later.
Well, no, I wouldn't expect that. The piezo buzzer uses through-hole leads, which are typically wave soldered in mass production. You'd need to stick on only the buzzer and then run the entire PS4 mobo through the wave soldering stage, then go back and pick/place all of the rest of the components if you wanted to assemble it in one piece (because you obviously can't have SMDs dotting the entire board when the wave of solder comes flowing, lol); this would be very inefficient I suspect.

My guess is they break off the buzzer board, then have it assembled separately.

All married men can relate to you.
I knew this joke would be forthcoming as soon as I read the previous comment. :)
 
Well, no, I wouldn't expect that. The piezo buzzer uses through-hole leads, which are typically wave soldered in mass production. You'd need to stick on only the buzzer and then run the entire PS4 mobo through the wave soldering stage, then go back and pick/place all of the rest of the components if you wanted to assemble it in one piece (because you obviously can't have SMDs dotting the entire board when the wave of solder comes flowing, lol); this would be very inefficient I suspect.
My guess is they break off the buzzer board, then have it assembled separately.
But there are several through-hole leads on main mb.
 
So both MS and Sony went for 16nm FF+ TSMC, interesting. Wonder if this'll stay the same for Neo/Scorpio.


ESRAM could also be the culprit
Since PS4 slim uses TSMC 16nm, PS4K must be also in 16nm since it's the flagship model.

We know RX 480 power efficiency becomes worse after 1075 MHz. But Nvidia's 16nm GPU operates at higher frequency (above 1.7 GHz) with much better power efficiency. In fact I would expect 16nm transistors have much better power efficiency in 1.2~1.5 GHz. So we can see how fast SONY will push Neo this week.
 
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