Dont know if anyone posted but
http://www-03.ibm.com/press/us/en/pressrelease/34683.wss
http://www-03.ibm.com/press/us/en/pressrelease/34683.wss
The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.
IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). The custom-designed chips will be made at IBM's state-of-the-art 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y.