It's misleading to say that the ram is new tech. The ram in the HMC is traditional ram, the TSV on the bottom is proven tech.
A big challenge is cooling the stack properly.
Idk, reading more about it, it seems quite possible to be used in a console releasing in 2013. This is technology specifically developed to break the memory wall.
The Cell, XDR, and Blu-ray were bigger gambles.
HMC really looks cool.
What about Mejdrich cpu patents? (he is working as director of SOC architecture and principal architect Xbox).
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