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Hence design for double exposure, i.e. minimizing critical structures crossing the threshold between the two exposure fields. Question is: Would such a design be possible in a high performance chip.
Maybe someone with experience or insight into chip design can shed light on this aspect.
A passive silicon interposer is like an upper layer of metal without the complexity of an active layer or a lot of local connection complexity. Its behavior across a stitch boundary would be analogous to what would happen if metal layers in a GPU had to make a similar connection across a die boundary.Yes, I see. Initially, I was not thinking along the lines of an interposer but maybe what can be described as a MCM-on-die.
But current Vega are as silent as vacuum cleaners...
GF1070FE is 38,8dB, correct me if I'm wrong but 3dB of difference means twice the noise no?Current Vega are pretty good if you just use the Power Saving mode which takes 3% or less from total performance.
http://hexus.net/tech/reviews/graphics/108889-amd-radeon-rx-vega-64-radeon-rx-vega-56/?page=15
GF1070FE is 38,8dB, correct me if I'm wrong but 3dB of difference means twice the noise no?
(Not sound engineer ^^)
Usually it's 10 db that's considered twice as loud. + 3dB though is emitting 2× the energy.GF1070FE is 38,8dB, correct me if I'm wrong but 3dB of difference means twice the noise no?
(Not sound engineer ^^)
In our (semi-)anechoic room, we can measure down to 13,4 dB(A) IIRC and that's a quietness-level, where the loudest thing you perceive is the blood flowing through your ears already. Makes me crazy if I'm in there for too long, have to take a break every 15 minutes or so.
Sounds exciting to me though, I just can't believe too much quietness can ever be a bad thing