Well, when I mention the configuration possibilities, I mean the actual number of chips because there are implications to the bus size as the latter needs to be identical between retail and devkit for obvious reasons i.e. the processors.
e.g. GDDR5 DRAMs have x16/x32 I/O configs, DDR3 can have x4/x8/x16, and it seems that 8Gbit DRAMs are only x4/x8 at the moment (Micron).
So for an all-DDR3 config (for example):
8GB = 16x4Gbit chips configured as x16 -> 16x16 = 256-bit bus, 16 chips
12GB = 16x4Gbit, x8 config + 8x4Gbit, x16 -> 16x8 + 8x16 = 256-bit bus, 24 chips
Another config might be:
8GB = 16x4Gbit, x8 -> 128-bit bus, 16 chips
12GB = 8x4Gbit, x8 + 8x8Gbit,x8 -> 128-bit bus, 16 chips
Anyways, whether or not they're likely for manufacturing/assembly purposes is the next thing.
Things get really messy with GDDR5 mixed in.