I would put my bet on HD 6850 lvl of perfs a bit lower actually (lower clock and possibly a bit less SIMD array).I'll attempt to predict the next XGPU assuming that die space dedicated to the GPU is close to Xenos, and that it is built with 22 fab process, and must draw less than 150 Watts at peak.
Looking back at AMD gpus that had die space between 250 mm2 and 260 mm2, the candidates are:
10/1/2005 X1800 254mm2 90nm 321 million transistors 500mhz 256mb GDDR3 ~140 Watts 83 GFLOPS
11/16/2005 Xenos ~260mm2 90nm 337 million transistors 500mhz 512mb GDDR3 125? Watts 240 GFLOPS
6/25/2008 4850 256mm2 55nm 956 million transistors 575mhz 512mb GDDR5 110 Watts 1000 GFLOPS
10/22/2010 6850 256mm2 40nm 1700 million transistors 775mhz 1024mb GDDR5 127 Watts 1488 GFLOPS
It's never going to happen, 22nm won't be available to anyone but Intel by fall 2013.A rough extrapolation of the next XGPU based on extremely dubious mathematics, namely the squaring of ratios between fab processes, the next XGPU looks like:
Fall 2013 Next XGPU ~ 260mm2 22nm ~5000 million transistors <1000mhz <=4096mb GDDR5/XDR2 <150Watts <~4000 GFLOPS
I would not discard Charlie's claims about MS using a SoC and expecting the first wafer to come back Q1 2012. So most likely a chip using the same process as llano, 32nm.I am by no means an expert at this stuff, so any help with this crystal balling will be appreciated.
Still iffy, I hope that Arstechnica's mole will shine in soon
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