GM204-A01 still foundry TSMC, 28nm technology, 8GB memory, will support DX12, and other parameters differ significantly from the post last month exposure.
The next step will be transferred to A2 trial production by the end of release. Performance is about GTX 780 Ti is about 110%, the price is about 3499 to 3999 ($ 499 - 549 excluding tax). The second half of 2015 GM204-B1 into 20nm manufacturing process, GTX970.
Above without official confirmed that any similarity is purely coincidental.
A post on Chiphell forums (translated) apparently has information about GM204.
That sounds like a really nice performance/$ improvement. What does the line about A2 mean exactly? That Googlenglish isn't very intelligible.
means that the next step is A2 silicon for production release.The next step will be transferred to A2 trial production by the end of release
That's my guess too (I'm not sure about the "trial" though).I think that this:
means that the next step is A2 silicon for production release.
But that is just a guess.
Could a 512-bit bus (possibly with less die area per interface like in Hawaii) be useful for its increased memory capacity over a 384-bit bus or is it not worth it?I just cannot see the HPC segement waiting for a 512-bit bus as they are primarily interested CUDA cores but then again I'm likely being ignorant and dumb.
Didn't Erinyes say that even the big, proper Maxwell will be on 28nm?
You're saying yourself that 16 FinFET is basically just 20SoC + FinFET. Which laws of physics are you referring to exactly since TSMC has stated in public the difference between 28HPm and 20SoC and 20SoC to 16FF?Economics and laws of physics from the looks of it say that 20nmSoC at TSMC is not that good for High performance components and TSMC 16nmFF is based on TSMC's 20nm which will be more of a step up from 28nm and be more viable.
Significantly? Are you SURE?One thing you can be sure about is that "laws of economics" would tell you that 3D transistors increase the manufacturing costs significantly.
Yeah I was referring to the GM200, I just went off a bit .He was quite sure about 204/206; I don't think he was ever certain about GM200.
I was referring to that developing die shrinks is getting harder due physical limitations and workarounds such as new technologies such as FinFETs are required to see notable improvements to make die shrinks viable, this all needs massive financial investment. TSMC have shown IIRC in a slide that the expenses of developing newer nodes is expensive as we go down. For 16nmFF I think that was more people saying 16nmFF is TSMC 20nm with FinFETs in general which seems to catch on.You're saying yourself that 16 FinFET is basically just 20SoC + FinFET. Which laws of physics are you referring to exactly since TSMC has stated in public the difference between 28HPm and 20SoC and 20SoC to 16FF?
One thing you can be sure about is that "laws of economics" would tell you that 3D transistors increase the manufacturing costs significantly.
Yeah I was referring to the GM200, I just went off a bit .
It doesn't really answer my question now does it? Is the jump in theoretical transistor density from 20SoC to 16FinFET at TSMC smaller or bigger than 28HP to 20SoC?I was referring to that developing die shrinks is getting harder due physical limitations and workarounds such as new technologies such as FinFETs are required to see notable improvements to make die shrinks viable, this all needs massive financial investment. TSMC have shown IIRC in a slide that the expenses of developing newer nodes is expensive as we go down. For 16nmFF I think that was more people saying 16nmFF is TSMC 20nm with FinFETs in general which seems to catch on.
The 16FF and 16FF+ technologies are "ready for prime time," according to Sun (left). He noted that the 16FF yield has already caught up with the 20nm planar (20SoC) process node. As a second-generation FinFET technology, he said, 16FF+ can provide an additional 15% die size reduction compared to 20SoC.
Liu said that TSMC plans 15 16FF tapeouts this year, and that compared to 20SoC, 16FF can provide a 40% performance increase at the same power consumption. 16FF+ allows an additional 15% performance increase. Volume production for the 16nm FinFET nodes is expected in 2015. "We are confident that our customers can use this [16nm] technology to produce mobile devices superior to those produced by IDMs," he said.
So the new code name is Ethan.Unless things go vier wrong yes and more Ethan one chip.
So the new code name is Ethan.
So did I. I was joking.I took it as a typo...