Like, I know the guy was right before. But isn't this the same leak from like a month ago? The one that doesn't make a lot of sense because why would anyone make a chiplet that big with that low of a yield if you could just cut it in half and see yields skyrocket, design costs plummet, and get whatever flexibility you want with binning. Besides which, they'd need to design multiple chiplets for this (rather than one and just reuse like with Zen), cut another 25% of power just to hit 360 watts for this "160cu" top end chip, and run a 512bit bus with 18gbps GDDR6 or HBM just to supply the thing.
I'm just going to go ahead and doubt this one a bit, at least until concrete information on how this is supposed to be supported at all emerges.