AMD: R8xx Speculation
- Thread starter Shtal
- Start date
Sound_Card
Regular
I'm so jealous, I did not get to see it. Was removed.
Automatic Pre-Tessellation Culling. To be presented at Siggraph 2009.
DX11 Hardware announced, PC Perspective has a wafer shot(halfway down):
http://www.pcper.com/article.php?aid=724
According to article approx 180mm2
http://www.pcper.com/article.php?aid=724
According to article approx 180mm2
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Unknown Soldier
Veteran
Was just about to post.Pretty kewl imo. that AMD has a work silicon already.
Sound_Card
Regular
180mm2 seems a bit underwhelming.
Perhaps not the performance part. Hard to believe that they would drop their target die size by almost 70mm2 from RV770.
Perhaps not the performance part. Hard to believe that they would drop their target die size by almost 70mm2 from RV770.
Unknown Soldier
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Where did this october date pop up, after several reports of first being pushed from Q4 to Q3 and then to early Q3, it jumped as far as 2010 and now october?
Charlie's stream of thought is that RV870 is already in production and A11 silicon is good to go, just like RV740. like RV740 they need months to build enough quantity of it to reach decent shipping levels. I can imagine that with RV740 only reaching 20% of it's wanted/needed launch capacity, things might not look that rosy for massive RV870 availability in the near future. The October timeframe comes from ATI's Win7 statement. which seems like a smart choice to me, a couple of months more inventory will see the supplies not drying up after a couple of weeks (like RV740.) His other info (which looks like the same source (over at chiphell?) says GT300 needs another respin to attain nV's targeted performance and will thus be postponed till 2010.
The other iqn'campment (theo, fudo) get fed other info spoonfed through what seems to be an nv partner view. where everything seems to be much more doom&gloom for AMD and quite positive news about nV's design wins and great strides forward (though they are, quite late now)
But, we have something to hold AMD to it's word:
http://www.pcper.com/images/reviews/724/20.jpg
First to deliver DX11 hardware. DX11 hardware shipping to ISV's THIS month. if Anything, that means that RV870 is a good month or two ahead of GT300.
AVI's courtesy of VR-Zone (thanks fellix)
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2920.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2927.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2930.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2932.AVI
Dev's on DX11
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2945.AVI
Red Dress people.
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2920.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2927.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2930.AVI
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2932.AVI
Dev's on DX11
http://resources.vr-zone.com/eventpics/Jun09/Computex/MVI_2945.AVI
Red Dress people.
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Looking at the wafer before the chip is quite a bit off square....Memory has failed me at the moment, is there any reason other than pad limiting to do this? It seems small enough i guess that the sideport is gone.
With TSMC troubles they are going to be racing to get a part out by the time windows 7 launches, need perfect execution, could really do with an extra month breathing space.
With TSMC troubles they are going to be racing to get a part out by the time windows 7 launches, need perfect execution, could really do with an extra month breathing space.
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