AMD: R8xx Speculation

How soon will Nvidia respond with GT300 to upcoming ATI-RV870 lineup GPUs

  • Within 1 or 2 weeks

    Votes: 1 0.6%
  • Within a month

    Votes: 5 3.2%
  • Within couple months

    Votes: 28 18.1%
  • Very late this year

    Votes: 52 33.5%
  • Not until next year

    Votes: 69 44.5%

  • Total voters
    155
  • Poll closed .
Looking at the wafer before the chip is quite a bit off square....Memory has failed me at the moment, is there any reason other than pad limiting to do this? It seems small enough i guess that the sideport is gone.

With TSMC troubles they are going to be racing to get a part out by the time windows 7 launches, need perfect execution, could really do with an extra month breathing space.

The hints we got were that yields on 870 were higher than on 740. that would still give them like, 40 to 50k of good units to work with. Taking into account that production is already underway for a couple of months they should have units aplenty for a high-end launch.
 
Looking at the wafer before the chip is quite a bit off square....Memory has failed me at the moment, is there any reason other than pad limiting to do this? It seems small enough i guess that the sideport is gone.

No idea on the reasoning but I recall RV610 & RV620 being a similar shape...

Evergreen- ~11.76mm x 15.38mm = ~181mm2
RV610- ~7.7mm x 10.7mm = ~82.4mm3
RV620- ~7mm x 9.5mm = ~66.5mm2

Edit- Largon brought up an interesting point(on a diff forum), could this be AMD sandbagging? AMD touting this chip as their largest when in fact it is a RV830/RV840 meant to eventually replace top RV770/790?
 
Very impressive that they've got it running so early for sure - grats guys. I wonder: could this be a 192-bit GDDR5 part aiming at replacing everything up to and including HD4890? I certainly doubt it's 256-bit at that size, but it's a bit big for 128-bit too... Hmm!
 
Very impressive that they've got it running so early for sure - grats guys. I wonder: could this be a 192-bit GDDR5 part aiming at replacing everything up to and including HD4890? I certainly doubt it's 256-bit at that size, but it's a bit big for 128-bit too... Hmm!


RV670 had 192mm² so the difference is not so big, except that GDDR5 is said to need more pins than GDDR3.

So 256bit could still be possible, or?
 
LordEC911 said:
AMD touting this chip as their largest when in fact it is a RV830/RV840 meant to eventually replace top RV770/790?
I wouldn't call it RV840, but it would be nice to see what AMD could do with ~320-360mm^2....

384-bit/768MB GDDR5
96 tmus
48 rops

/drool...

They could probably have the single chip performance crown with that and sell it for $50-100 less than their slower competition. I doubt such a thing exists though, it makes too much sense.

@Arun: perhaps 224-bit?
 
Full slide deck:

http://www.hardocp.com/image.html?image=MTI0NDAwNDgyMEZJUWRlV3BYeEtfMV8xX2wuanBn

Also the "sooner than you think" line might be nothing more than a reference to games with D3D11 features. e.g. I'm guessing, based on the final "developers talk D3D11" video, there'll be a patch to update Battleforge.

Jawed

Looks like some more DX10.1 games will get the DX11 treatment. other pics from that slide are from H.A.W.X.

With Codemasters I can see the upcoming Fuel and DiRT2 making 2009 DX11 releases.
 
Edit- Largon brought up an interesting point(on a diff forum), could this be AMD sandbagging? AMD touting this chip as their largest when in fact it is a RV830/RV840 meant to eventually replace top RV770/790?

Wouldn't be surprised. 180mm^2 sounds too conservative even for AMD. Although, it's too big for an RV840 too....hmmmmm. Guess size doesn't matter if the performance is there.
 
The surface pattern of the die is rather curious of what it seems to be four cross-symmetrical rectangular shapes.
It's more than curious, it's downright mystifying.

I can't help thinking that the small size of this chip implies it's not the biggest of AMD's 40nm D3D11 chips from the upcoming generation.

The non-squareness seems to be making about 2% difference in area. For what it's worth I get 11.71 * 15.51 = 181.6mm². A square die (same perimeter) would be 13.61mm on each side = 185.3mm².

Perhaps this is a 128-bit bus chip, i.e. RV740 + D3D11 + extra clusters. It would be brutally powerful, with <=16 clusters, 1280 ALU lanes, 64 TUs.

But that layout looks like a radical redesign. It makes me think it's a "memory-centric" design, where each of the "quarters" we're seeing on the die has its own memory interface. Trouble is, that sounds to me like you'd want a ring bus.

Jawed
 
No idea on the reasoning but I recall RV610 & RV620 being a similar shape...

Evergreen- ~11.76mm x 15.38mm = ~181mm2
Using the above figures, a square chip of same area would be 13.45mm each side, comparing perimeters gives all of 0.5mm more perimeter to the rectangle shape over the square. Its like they just needed that little bit extra ;)

Edit- Largon brought up an interesting point(on a diff forum), could this be AMD sandbagging? AMD touting this chip as their largest when in fact it is a RV830/RV840 meant to eventually replace top RV770/790?
If they did such a chip, it would be quite some risk at the moment. I could possibly believe this was the juniper chip if it was a little smaller, but not at ~180mm2. As Arun said that implies a 192bit interface(maybe more), which in turn would require a 128bit and 64 bit part below to cover all the market segments.

The hints we got were that yields on 870 were higher than on 740. that would still give them like, 40 to 50k of good units to work with. Taking into account that production is already underway for a couple of months they should have units aplenty for a high-end launch.
Production underway? I dont think TSMC will be able to get going on this and the brother chip for about another month. Nvidia is in same boat, if only windows release was a bit closer to christmas.
 
We still don't know how well analog parts are scaled down with the new 40nm process.

The other curious thing is that until now, we haven't seen any 200+ mm² chip designs on the TSMC's 40nm tech. Both ATi's DX11 GPU and the current RV740 are small-scale parts, and the rumored GT21* line won't be a big daddy. Is there some fundamental flaw in the manufacturing process that makes it undesirable for mid- and large-sized ASICs?
 
The perimeter of RV770 is ~65mm, so the ~54mm perimeter of this chip is pretty close. The length of RV770's CrossFireX Sideport is ~5.6mm. ~5mm of RV770's perimeter also looks to be either unused, or filled with non-IO stuff.

So it seems the ~54mm perimeter is very close to being able to fit a 256-bit bus...

I suppose it's worth pointing out that corners can't be "double-counted" when talking about perimeter for IO purposes, since the depth of IO areas is pretty large, ~1mm for GDDR.

Jawed
 
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