Looking at the wafer before the chip is quite a bit off square....Memory has failed me at the moment, is there any reason other than pad limiting to do this? It seems small enough i guess that the sideport is gone.
With TSMC troubles they are going to be racing to get a part out by the time windows 7 launches, need perfect execution, could really do with an extra month breathing space.
The hints we got were that yields on 870 were higher than on 740. that would still give them like, 40 to 50k of good units to work with. Taking into account that production is already underway for a couple of months they should have units aplenty for a high-end launch.