According to Timothy Lotte (designer of FXAA et al), he expects next gen to be about 6 times as powerful as 360 is. This is just a tad faster than todays very high end laptop GPUs. I find this quite a small leap, considering a 7+ year leap in technology.
Interesting to consider that next console rumors of 6x Xbox360 perf and 2013 launch, is slightly above a the 2012 notebook and at the low-end 2012 PC GPU.
It would be especially sad and somewhat funny if they'd do something like I've seen done before that they get 3x real-world performance increase from GPU and as much from CPU and they add 3+3 to get 6x increase.I was more thinking of "6x across the board". Not something as meaningless as flops. But I might've been off anyways, as I was thinking of my 6870 as "at least 6x the power".
Indeed. TDP sounds reasonable too given it will likely be at least partially based on sea islands if it debuts holiday 2014. Peak 7850 TDP is around 100W, leaving 80 to 90W for CPU and the remainder for other peripherals in a 200W budget.
Actually the consoles of this gen were far from 300W. Their power supplies were rated at around 200W-ish peak output, they were consuming less than that on full load.
The original PS3 had a 380W power adaptor (although in operation the console had a peak consumption of only around 200W).
That was also around a 5x jump in power consumption compared to its predecessor the PS2. Although I don't expect another jump of near that magnitude this upcoming generation, I don't share the view that we have hit some mythical barrier at 200W.
Chips that generate so much heat are probably a much bigger cost factor than those couple of 100 grams of extra shipping & copper.
step 3 put the box in a closed cupboardNow put it in a box.. step 2 cut a hole in the box..
Maybe we should come up with what kind of "power" term we are discussing. TDP, PSU Power, Actual usage at AC socket.
PS3 was around 200 watt at the AC, so that would suggest a TDP that was at least 20% lower? So a TDP at around 160 Watt for CPU+GPU
GTX 680 is at 195 TDP 580 was at 244 Watt, both of these was cooled by a fan and a heat sink, most likely a somewhat expensive Heat sink. Add to this the CPU and the PSU's cooling requirements. Now put it in a box.. step 2 cut a hole in the box..
That would be a tiny hot box.. and would require a bit hole.. But i think that with the advances in cooling (a GTX680 can be cooled at reasonable sound leves) more than 160 TDP should be possible.
https://www.power.org/resources/devcorner/cellcorner/hpcspe.pdf
IBM says the original 90nm Cell was 110W TDP at 3.2Ghz (page 14)