I didn't react much to the rumors Charlie unleashed, I happen to have some time
so let speculate (assuming there is truth to his talk that's it).
So the first chip A0 silicon is to come back to Redmond sometime during Q1 2012. It's a SOC.
Various thoughts:
1) I expect the chip the chip to be produce using IBM or GF 32nm lithography.
2) I believe that IBM lithography allowing for EDRAM is not ready @32nm, so if there is EDRAM on board MS would have to use their 45nm process. In addition I believe that this process may be costlier than their standard process => so see point one.
3) we can't expect a crazy high silicon budget, I believe that a +300mm² chip is a best case scenario. Somewhere between 250 and 300mm2 sound right (costs). I believe that next gen will be overall pretty costly to produce not only due the silicon/brain of the system, they have to pack kinect, a pad, +2GB of RAM, a unknown amount of Flash memory, a HDD and an optical drive and possibly a WiiU like controller. In this creepy economic climate I don't expect miracle in the upcoming two years, I don't see MS going for more than 499$ the the highest SKU, neither I see MS losing as much money as they did with the 360 at first (without taking in account RroD cost).
4) System will have to last and to be secured.
For the CPU.
*I believe that one implication for the CPU is that MS will want the max bang for buck out of the silicon they invest into the CPU (and the sytem overall). I believe that they will favor TLP (versus ILP) once again. So I believe that the chip will somehow resemble Xenon and Power A2/EN. It's the cheapest way to pack enough execution resources to grant the system some legs.
* I expect the integer pipeline and front end of the CPU to be reuse of the Power A2 design or close parents (In Order, 2 issues, 4 way SMT).
* I don't expect wider SIMD, I read (I can't find the source tho) reading that overall the amount of SIMD code in most workload (physic, AI, etc) is low, SMT is a good way to make most out of the SIMD units in those case.
* I also hope they will implement some support for scatter/gather, the same kind as described in some Intel white paper. It's supposedly cheap to implement (especially with pretty narrow SIMD 4-wide) and should grant a neat boost to SIMD units utility and utilization.
* I expect them to go with 6 cores running at lower speed than xenon was (2.4GHz?).
* I expect 3 MB of shared L2, as Ms won't use EDRAM and won't get the benefit in power consumption and density, I believe 3 MB is the maximum amount to expect (same as a Core i3).
* I expect extensive clock gating as in Power A2.
For the GPU.
* I expect MS to have put its hand on AMD GCN architecture. I expect that the CPU and the GPU will share the same memory space, I also hope that it will be possible for the GPU to read and write from (or lock some parts of) the L2 as Intel gen6 is doing with the L3.
* I expect 3 " geometry engines" (not sure about how AMD is calling that) so the GPU can spit out an impressive amount of triangles. I expect triangles and tesselation to be the new GFLOPS in term of PR bullet point
.
* SIMD arrays in GCN seem to work by 4 (a scalar unit is shared by 4 SIMD arrays), I expect 12 of them running at conservative clock speed.
* I expect the system to be light on RBE.
* I expect the power consumption of the GPU to be capped.
Msic.
I wonder if MS could be interested to add some of the Power A2 networking and security engine, so Live security is really a first class citizen.
For the RAM.
I will rally Laa-Yosh professional POV, properly fill up to 2GB of RAM will be expansive enough. So I would expect 2GB of "not that fast" GDDR5 on a 128bits bus. (not sure DDR4 will have been considered if silicon is to get back as early as Q1 2012). So I assume +60GB/s of bandwidth.
For the optical drive, I wonder BRD player seems an obvious choice but x4 players are still not that cheap. Overall I would not be surprised if MS use some form of HD-DVD (so 15GB up to 30GB of storage). Ms is still pushing digital content distribution through Live and they may think it would help fighting piracy.
For storage, I don't believe that HDD will be standard this time again. On the other hand I expect the system to include 16 GB of flash memory (some reserved for the OS, caching, the rest available for DLC, save, etc.). I expect the system to support USB key for storage from scratch. I also expect MS to push proprietary BS for the HDD this time again...
Last point backward compatibility. I don't think Ms can pass on it, I'm not sure either it would be easy to emulate Edram with +60GB/s worse of bandwidth no matter the way more powerful RBEs, so I believe MS may simply pass on the headache and attached Xenos daughter die to the SoC (which would be not accessible to the devs so it can be removed later in system life).
------Huge EDIT--------- Got a look at llano review and realize I may have overstate what can possibly fit in the design.
nice way to say I'm bored...
So the first chip A0 silicon is to come back to Redmond sometime during Q1 2012. It's a SOC.
Various thoughts:
1) I expect the chip the chip to be produce using IBM or GF 32nm lithography.
2) I believe that IBM lithography allowing for EDRAM is not ready @32nm, so if there is EDRAM on board MS would have to use their 45nm process. In addition I believe that this process may be costlier than their standard process => so see point one.
3) we can't expect a crazy high silicon budget, I believe that a +300mm² chip is a best case scenario. Somewhere between 250 and 300mm2 sound right (costs). I believe that next gen will be overall pretty costly to produce not only due the silicon/brain of the system, they have to pack kinect, a pad, +2GB of RAM, a unknown amount of Flash memory, a HDD and an optical drive and possibly a WiiU like controller. In this creepy economic climate I don't expect miracle in the upcoming two years, I don't see MS going for more than 499$ the the highest SKU, neither I see MS losing as much money as they did with the 360 at first (without taking in account RroD cost).
4) System will have to last and to be secured.
For the CPU.
*I believe that one implication for the CPU is that MS will want the max bang for buck out of the silicon they invest into the CPU (and the sytem overall). I believe that they will favor TLP (versus ILP) once again. So I believe that the chip will somehow resemble Xenon and Power A2/EN. It's the cheapest way to pack enough execution resources to grant the system some legs.
* I expect the integer pipeline and front end of the CPU to be reuse of the Power A2 design or close parents (In Order, 2 issues, 4 way SMT).
* I don't expect wider SIMD, I read (I can't find the source tho) reading that overall the amount of SIMD code in most workload (physic, AI, etc) is low, SMT is a good way to make most out of the SIMD units in those case.
* I also hope they will implement some support for scatter/gather, the same kind as described in some Intel white paper. It's supposedly cheap to implement (especially with pretty narrow SIMD 4-wide) and should grant a neat boost to SIMD units utility and utilization.
still I believe it won't happen...
* I expect 3 MB of shared L2, as Ms won't use EDRAM and won't get the benefit in power consumption and density, I believe 3 MB is the maximum amount to expect (same as a Core i3).
* I expect extensive clock gating as in Power A2.
For the GPU.
* I expect MS to have put its hand on AMD GCN architecture. I expect that the CPU and the GPU will share the same memory space, I also hope that it will be possible for the GPU to read and write from (or lock some parts of) the L2 as Intel gen6 is doing with the L3.
* I expect 3 " geometry engines" (not sure about how AMD is calling that) so the GPU can spit out an impressive amount of triangles. I expect triangles and tesselation to be the new GFLOPS in term of PR bullet point
be prepared for the next fans war...
* SIMD arrays in GCN seem to work by 4 (a scalar unit is shared by 4 SIMD arrays), I expect 12 of them running at conservative clock speed.
* I expect the system to be light on RBE.
* I expect the power consumption of the GPU to be capped.
Msic.
I wonder if MS could be interested to add some of the Power A2 networking and security engine, so Live security is really a first class citizen.
For the RAM.
I will rally Laa-Yosh professional POV, properly fill up to 2GB of RAM will be expansive enough. So I would expect 2GB of "not that fast" GDDR5 on a 128bits bus. (not sure DDR4 will have been considered if silicon is to get back as early as Q1 2012). So I assume +60GB/s of bandwidth.
For the optical drive, I wonder BRD player seems an obvious choice but x4 players are still not that cheap. Overall I would not be surprised if MS use some form of HD-DVD (so 15GB up to 30GB of storage). Ms is still pushing digital content distribution through Live and they may think it would help fighting piracy.
For storage, I don't believe that HDD will be standard this time again. On the other hand I expect the system to include 16 GB of flash memory (some reserved for the OS, caching, the rest available for DLC, save, etc.). I expect the system to support USB key for storage from scratch. I also expect MS to push proprietary BS for the HDD this time again...
Last point backward compatibility. I don't think Ms can pass on it, I'm not sure either it would be easy to emulate Edram with +60GB/s worse of bandwidth no matter the way more powerful RBEs, so I believe MS may simply pass on the headache and attached Xenos daughter die to the SoC (which would be not accessible to the devs so it can be removed later in system life).
------Huge EDIT--------- Got a look at llano review and realize I may have overstate what can possibly fit in the design.
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