Does that make sense when there looks to be less room for die shrinking, so less price reduction and probably no chance at hitting a non-lossy $200 pricepoint. I think the design will be based on predicitions of what process tech will be like 5 years into the generation, and a rather conservative prediction at that given this gen's lessons. PS3 was supposed to launched at 65nm, but missed the mark, and process shrinks haven't had the gains that PS2's process shrinks had. They'd possibly look at around 300-400 mm² aiming for a smaller die size and cheaper cooling by the time the consoles get slimified.
The bulk of cost in silicon production is capital expenditures cost from equipment investment. The running (production) cost is only a fraction of total cost.
Once downscaling slows down significantly, the amorization period of these expenditures increases. This means that the per transistor price will continue to fall for a long time afterwards. Once production costs dominate, fabs will concentrate on reducing those by using even more automation, move to 450mm wafers etc.
There will probably be more focus on initial power consumption. With downscaling slowing down, it is less likely to reduce power draw much. Power draw directly influences the cost of the cooling solution as well as reliability.
Cheers