wow... :smile:
I was few hours away and did miss all this conversation? :smile:
anyways, AFAIK, Matrox isn't creating so much memory bandwidth limited card than nowadays cards are. I have heard that they have memory bandwidth available as much as 256 bit DDR memory interface would give on running at 300Mhz speed. (makes little bit under 20GB/s) but I have now idea how they are gonna reach that memory bandwidth. There are a lot of possibilities: eRAM, MultiChip, 256bit interface or perhaps QBM/QDR memory?
and couple of more things... first, everyone is talking about making walls and other things with Displacement Maps, but that could be done also with bump maps (does not look so good though.) How about using Displacement maps for generating real time Height Fields?
second, If I have understood right, displacement mapping needs very powerful tesselation unit that is able to read vertice displacement values from bitmap and because of that, it needs to access that bitmap many times during tesselation. Am I right?
if yes, then how about making a "room" on chip for displacement maps so that tesselation unit can access that almost without latencies? (oh well, I could ask this directly too: would be there any advantage placing displacement maps on-chip memory?)
I really don't know if anyone is interested, but IF Matrox has been working with something, we should start seeing things before or at least on GDC. Next event on Matrox calendar is E3 and I don't think they are going to show G550 cards there. :smile:
EDIT: how on earth I was able to do so many typos to single post??
<font size=-1>[ This Message was edited by: Nappe1 on 2002-02-11 23:45 ]</font>