Why buy 2 x 8 cores instead of a cheaper 1 socket board with a cheaper 16 cores cpu?
Ok, memory and pcie lanes, but what kind of market is so sensitive to those?
That 7007$ Intel quad core is a steal
Suprising FP results... 32-core EPYC vs 28-core Skylake-SP Xeon:
http://www.anandtech.com/show/11544/intel-skylake-ep-vs-amd-epyc-7000-cpu-battle-of-the-decade/21
EPYC seems very strong. Zen cores seem perfect fit for enterprise. Energy consumption also looks nice. And AMD has priced them aggressively (half price for same perf in many cases).
They can't play a price war, yields for those monster dies (the 28core ones) must be terrible in comparison to yields for 4 zeppelin dies. Hence, "It's 4 desktop cores re-purposed for the server space! This is not what you want!" in their official release slides That whole presentation reeks of desperation, almost half of it is dedicated to Epyc. Not to mention they did cite wccftech (lol) and even left a session id in one of their links ( ). Surely not what I expected from Intel. But hey! Maybe it works with investors ¯\_(ツ)_/¯
Not just 4 dies but the same die so AMD and GloFo didn't need to spend I+D perfecting several Die designs, they just needed to spend all their I+D into perfecting a single design and making it the best chip their I+D budged let them. The yields most be close to the theoretical perfect yield possible by the process.
Also knowing that the die is the same in every single SKU is not a desktop cpu re-purposed to server use its a server CPU re-purposed to desktop use.
I think in the future we will look at zen as a CPU ahead of its time even with its flaws, the concept of develop a single Die, using all ur resources into making it the best die you can create and then use it in ur entire line-up its something that I think we will see not just in the futures CPU but GPU as well. Its not perfect but no design is, looking at what zen is able to do(from low TDP laptops to high end servers) this concept has shown a incredibly good balance in its concessions.
Focus on one die AND bin the server grade products against the consumer ones. The Epyc chips could be "perfect" silicon with no defects and ideal power characteristics.Not just 4 dies but the same die so AMD and GloFo didn't need to spend I+D perfecting several Die designs, they just needed to spend all their I+D into perfecting a single design and making it the best chip their I+D budged let them. The yields most be close to the theoretical perfect
Maybe it's not at all an economic gain to cut prices in these market segments. Discounts can oth mean "sign of weakness" for the corporate resposibles for purchases.
AMD is on a different position (0% marketshare) and lower prices are one of their few cards to play.
No doubt they are, since AMD does binning for Ryzen Pros tooFocus on one die AND bin the server grade products against the consumer ones. The Epyc chips could be "perfect" silicon with no defects and ideal power characteristics.
Not just binning, but having some extreme bins. A 99% or higher quality bin could be feasible. Just consider Epyc volumes as a fraction of all the Ryzens they are dumping to consumers. Normally the server products are their own chips and will lack that volume.No doubt they are, since AMD does binning for Ryzen Pros too
https://www.techpowerup.com/235092/...cessors-glued-together-in-official-slide-deckSo, yes, Intel, I think the AMD engineers who have developed the Zen architecture from the ground-up would take issue with that. Especially when AMD's "Glued-together" dies actually wipe the proverbial floor with the blue company's chips in power-performance ratios, and deliver much better multi-threaded performance than Intel's offerings. Not bad for a "Glued-together" solution, I'd say.