Usually tapeout is when the design is completed and you upload the files to the foundry FTP/portal/cloud.6 months typically from tape out to release?
Then the foundry generates the photomasks and tools to build the silicon. For a 7 die chiplet, with extra time needed for interconnect and packaging, I expect 10 to 12 weeks before the customer gets the silicon back from the package factory (Amkor, ASE, etc)
Then qualification will take at least another 6 months.
I think one year from tape out to HVM is realistic if taking into account one minor revision (metal mask)
Edit: Lately, Nvidia has been extremely efficient and fast from tape out to HVM. Most of their first silicon revision (A0) went into HVM
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