AMD: RDNA 3 Speculation, Rumours and Discussion

Discussion in 'Architecture and Products' started by Jawed, Oct 28, 2020.

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  1. Bondrewd

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    He's still the only Weibo tourist who filters his shit before posting so kudos to him I guess.
     
    #1001 Bondrewd, Oct 29, 2021
    Last edited: Oct 29, 2021
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  2. But is there any truth to what he posts, then?
     
  3. Bondrewd

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    Some yes some no!
    Filter it yourself based on what you know as usual.
     
  4. iroboto

    iroboto Daft Funk
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    IIRC you mentioned that it will not be MCM?
     
  5. Bondrewd

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    That's N33.
    He's BSing the TO date for N31.
     
  6. Leoneazzurro5

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    So it has not yet taped out, or was it taped out earlier? Because some say that N33 will be the only RDNA3 part for 2022, while some say that also highend should come next year. But, if N31 taped out, the chance to see it in action next year rises a lot.
     
  7. iroboto

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    not too familiar with AMD naming conventions, but Is 33 the 'big chip' and the 31 the mainstream chip?
     
  8. Bondrewd

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    The opposite.
    31 is the big chungus giga-MCP while 33 is the N6 mainstream single die.
     
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  9. Tofu

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  10. Bondrewd

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    Clamshells are very not practical in mainstream stuff.
    Uhhhh ohhhhh.
    #prayfor24GbitICs
     
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  11. w0lfram

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    I really think with the newer fabric AMD will achieved unified cache with dual/quad gpus. Raster is king for buying power and AMD knows this. As other suggest, AMD will dip into RT wholly, when gamers demand it...
     
  12. Bondrewd

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    It really is a single GPU with a somewhat funky topology.
    Uhhhhh no only the biggest bars go!
     
  13. del42sa

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    3D IF ? Cool
     
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  14. Granath

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  15. no-X

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    Is it really a new thing? Aren't the rumored active interposers / bridges (incorporating Infinity Cache) for Navi 21/22 already a 3D Infinity Cache solution?
     
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  16. Bondrewd

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    Nope.
    Not a 'possibility' the thing is made like that.
    bingo.
     
  17. yuri

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    Correct me if I am wrong: The "bridge chip" bonding the two "computing chips" of Navi 3x together is glued on top of them. So the bridge itself actually is 3D. Since the bridging logic is not that big it doesn't seem probable to complicate the design by adding the 512MB cache as yet another 3D layer on top of the "bridge chip".

    So yeah, it doesn't seem to bring any new info.
     
  18. Leoneazzurro5

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    I think the idea is to bond (more than two) cache + I/O chips below the two compute dies in Navi31/32, not above. For the simple reason that you need to connect those I/O pins to the PCB.
     
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  19. Jawed

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    Which I/O pins?
     
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