EhhHe says in a comment that he measured the SOC temp from the back of the board, so it isn't so much an accurate reading of the SOC, but the PCB below it. But if he measured both systems in the same way, it should be a fair comparison. I'd like to see more also, though.
Also, the comments are turning into the dumpster fire you would expect.
So I get the reluctance around measuring thermal exhaust is bullshit as a metric in isolation. But measuring exhaust temperature is actually one part of the equation for determining thermal resistance of a heat sink.
Some of the white papers I’ve read drill a hole into the heat sink contact plate and place a probe with thermal paste into the hole and that’s just about as close to the soc you can get from the point of the contact to dissipation into air.
not quite sure about measuring the back of a PCB. I’m no longer sure if you’re measuring the heat sink or perhaps a different chip, etc. But I suppose if the only answer one is looking for that it is superior; perhaps that would suffice.