tldr; without measuring the chip itself it's impossible to know if the increase in exhaust temperature is an efficiency improvement or not. Everyone saying it's hotter means the cooling is worse is no more wrong than people saying that more exhaust means cooling is more efficient. Both are wrong because to measure efficiency you have to measure the chip temperature vs the air temperature, or in this case, the exhaust. That being said, reducing the conductivity of materials for cooling and reducing surface area will likely result in a loss of cooling efficiency. I don't see a design change here with the fins/setup that will warrant a massive improvement over the original with such reductions in place. The chip may not have needed it to begin with so cutting back materials now that they see the maturity of their system may just be what this is. Ultimately this is a cost cutting setup. it's very likely running hotter at the chip by some amount, but it probably doesn't matter.Austin Evans and co. took apart the newer, lighter PS5 and found a much smaller heatsink assembly. Unsurprisingly the new unit runs hotter.
The look of it gives me PS4 Pro PTSD...
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It is difficult to know whether or not the cooling is improved but we can make some very conservative assumptions about its cooling with respect to what we can see.
Using the equation Q = (Tchip - Tair) R you can determine the heat resistance level of a heat sink configuration. By in large a lower Q means a better transmission of heat from the chip to the air.
Ie: when the claim is made exhaust is hotter means it’s cooling better: by keeping all variables the same except adding say 5 Kelvin to Tair your new Q is lower than the previous one.
however we know they aren’t the same and the components that make up R in this case we know are worse. What makes up R is the combination of resistance from TIM, it’s Spreading capability, and heat sink capacity which the latter 2 are changed. In particular the sp value is reduced in area and the conductivity has moved away from copper.
In the best case scenario here, Sony would have aimed to have a heat sink configuration to be the same as the original PS5 but doing so by cutting costs. If that is the same and we assume that Q1 = Q2; then a 5 degree Kelvin exhaust increase also means a 5 degree Kelvin increase at the chip.
If they managed a better Q (lower) then likely the chip is the same temperature but the exhaust is more. Frankly, it’s not determinable without measuring the heat sink/base contact point.
but reasonably one has to assume that the reduction in surface area combined with a reduction in conductivity is leading to a higher temperature at chip. Unfortunately there is no real way to know without measuring the heat sink bases directly to find out. We jus have to make some assumptions around what Sony feels is tolerable heat for their chip.
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