Its perplexing to me how you can have such a large console and still have some thermal issues , Hopefully they re visit when the add on ssds are announced and supported. I have a feeling they are going to get cooked in there
Most of the temps may be well in-line with the quasi-appliance aspect of these boxes. Relative to PC, the consoles have tended to err on the side of being warmer if it saved money or reduced noise--mostly saved money.
Aside from the GDDR6 module, some things like taking a long time to cool down after shutdown might be preferable if there's a worry of thermal cycling. Rapid temperature changes can cause additional stress, and if the packaging and design assume a gradual thermal drop they'll likely do better than if they were facing a quick drop to ambient.
I heard a passing comment about the fan not generating enough pressure, although I'll have to rewatch to get full context. Some of the warmer components may not be expecting much airflow from the fan. There are actual instances of foam blocking some paths out of the fan chamber to some of the system recesses, for example.
I can't believe how cool the SOC is running.
They don't have direct measurements of SOC die temps, so there is some uncertainty based on all the other packaging and cooler differences. It could be running cooler assuming nothing's influencing the conductivity down the package stack differently.
Might they have impacted the conductivity of that bottom memory chip by taking apart the machine? Seems odd that the rest are essentially within the expected range with the exception of that one. Everything should be equal among those modules, they've all got the same cooling solutions and similar proximity to the SOC (which anyway runs cooler than that memory module). The placement of that steel plate might have been slightly off effecting the top or bottom memory modules...?
It's possible that something changed with the alignment or thermal pads, coupled with the more varied fasteners and sandwiching of layers with the PS5.
Even if the disassembly didn't introduce thermal problems, I wonder if it's possible they got a bad sample. DRAM running hot isn't necessarily worrisome, but it does seem like that one measurement might be more borderline than it should be if the same box is meant for warmer conditions.
You can transfert a pretty good amount of heat through a pcb if done correctly. Sony has a patent for it btw, but it's not new.
I'm not saying they re using it, but it exists. And the ram chip are flip-chip, no ?
There's not much sign of this being present with what we've seen with the PCB. Relatively thick metal columns and special areas set aside on the bottom of the chip would be indicated by the patent. The PS5's board looks like it could be leaving room for a clamshell memory arrangement for dev kits, which means the areas on the SOC side of the GDDR6 modules have an existing use and existing wiring needs.
Also, the necessary footprint would likely need a custom footprint for the GDDR6 modules, or custom packaging to allow the proper thermal contact. Nobody's pried the GDDR6 off their console, to my knowledge, but a bespoke RAM package and potentially compromised board or package wiring seem unlikely to me.
I'm not sure if anyone measures the temperature between the pcb and the IC, and if ~90 degrees is even a thing to worry about, as the top of the chip is a somewhat okay 70 degrees or so.
I'd think that as long as it doesn't melt the solder it would be fine.
I thought the probe was touching one of the sides of a RAM module. There is some potential performance loss due to accelerated refresh rates at those temps, which is fine if it's expected but may not be if there's that great a disparity between neighboring chips. Running that close to the upper temp limits could be asking for thermal safeguards tripping in less-ideal but in-spec warm rooms.
