During an interview Crystal Dynamics said there will be PS5 improvement for Marvel Avengers
What's the timestamp for the mention on PS5 improvements?
I'm way too distracted by the humongous golden... thing.. wrapped around that guy's chest. (I mean.. why? That's either metal and painful to wear or a lot of plastic.)
I don't think there is any strong evidence to suggest RT cores take up a lot of silicon. Tensorcores on the other hand could.Recently, there has been a rumor that Oberon's (PS5 SoC) die size is 300mm^2. If we assume 40CU/36CU (devkit/retail), then would there be enough space left over on the die for dedicated RT cores?
Recently, there has been a rumor that Oberon's (PS5 SoC) die size is 300mm^2. If we assume 40CU/36CU (devkit/retail), then would there be enough space left over on the die for dedicated RT cores?
Obviously wont, looks ugly as sin. PS4 dev kits where big as well so it might be a norm.Damn that looks big? Don't think the final product is gonna look like that.
Here it is.
edit, looks like different radiators on both side of V. One for soc other for psu? ...or one for cpu chiplet and second for gpu
Obviously wont, looks ugly as sin. PS4 dev kits where big as well so it might be a norm.
cpu and gpu shouldn't be that far from each other. That's a lot of wasted power and increased latency for some extra ease of cooling.
Might just be a design feature. Without knowing what’s under the cover it’s hard to say.cpu and gpu shouldn't be that far from each other. That's a lot of wasted power and increased latency for some extra ease of cooling.
Ton of leaps of logic here.Maybe it utilises the strange heatsink patent that we've seen?
For example:
Also, might that patent be a means of providing adequate bandwidth between two GPU chiplets or SoC's? IIRC EMIB requires a fair amount of power, and therefore cooling, in order to provide adequate bandwidth for GPU chiplets. Those chiplets could be cooled with a traditional heatsink, whilst the interconnect is cooled from beneath.
- on the right hand side is contained the SoC with the main heatsink on the top. The vents on the right feed and expel the air for said heatsink.
- on the left hand side is contained the PSU. The vents on the left feed the PSU, and also circulates to feed the bottom heatsink of the SoC.
This could be a means of binning for 3 different consoles:
Manufacturing would improve over the years, and the PS4Pro Slim chips could be phased out, but it's at least a means of selling otherwise junk chips in the first year or two.
- Use 40CU chiplets. Disable 4 for redundancy.
- Those with the best thermal profile at the highest clocks are paired up for a PS5Pro.
- Those with a worse thermal profile at the same or lower clocks are separated for a base PS5.
- Those which can't reach adequate speeds could be binned for a PS4Pro Slim.
Obviously wont, looks ugly as sin. PS4 dev kits where big as well so it might be a norm.