More hits to the heart for the 4 PE's CPU fans (CELL)
- Thread starter Panajev2001a
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rendezvous
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MechanizedDeath said:
That's what i've come up with too.
Npl said:
The photo resist is/was applied by dropping it on the center and spinning the wafer.
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I don't think that applying foto resist is one of the more critical steps in the production chain.
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The silicon ingots are cylindrical due to the method used for growning them.
90 nm 300mm wafer
160 single core per wafer + strange logic or 80 double core per wafer + strange logic (no one think that it is edram ? ).. ..is a good yeld ?
P4 wafer (300 mm?) 180 cores (130nm)
the P4 at 180 nm was 217mm^2 (55Mtransistor) back in the 2001
the P4 at 130 nm was 131mm^2 (55Mtransistor)
G5 wafer (300 mm?) 175 cores (130nm)
the G5 at 130 nm SOI was 118mm^2 (52Mtransistor)
160 single core per wafer + strange logic or 80 double core per wafer + strange logic (no one think that it is edram ? ).. ..is a good yeld ?
P4 wafer (300 mm?) 180 cores (130nm)
the P4 at 180 nm was 217mm^2 (55Mtransistor) back in the 2001
the P4 at 130 nm was 131mm^2 (55Mtransistor)
G5 wafer (300 mm?) 175 cores (130nm)
the G5 at 130 nm SOI was 118mm^2 (52Mtransistor)
Actually, my armchair is more into software development...darkblu said:
nAo said:LOL..yeah..just send your CVvliw said:Any chance i can visiting you at work?
The papers you are searching for, have not been published yet in electronic form and in the first 2 volume of isscc 2005 there no sign about what you are interested in, maybe in march will see something happen.
