AMD: RDNA 3 Speculation, Rumours and Discussion

Discussion in 'Architecture and Products' started by Jawed, Oct 28, 2020.

  1. ethernity

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    upload_2021-4-5_18-21-50.png

    Although this illustration (from the patent mentioned above) is more coincidental or reused from other patent diagrams (which AMD has done in the past), there is that use of the X3D die on top of the GCD (which have TSVs).
    AMD did say they will share more info about X3D in time during the FAD 2020 webcast.
    Hopefully more info will trickle in the next months.
     
  2. Bondrewd

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    They can do it 3-Hi too but that's not particularly useful for now.
     
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