Sound_Card
Regular
IMHO only;
the RV635 has 120mm² with 4 TMUs and 120 ALUs; the RV670 has 192mm² with 16 TMUs and 320 ALUs. If you make a simple excel chart then you can see that a RV6xx with no TMUs and no ALUs at all would have ~90mm². Therefore the RV635 needs only 30mm² for 4 TMUs and 120 ALUs. If we devide this then 4 TMUs need roughly 15 mm² and 120 ALUs again 15 mm².
So a hypothetical RV770 with 32 TMUs and 640 ALUs would need 32/4 x 15 mm² (=120 mm²) + 640/120 x 15 mm² (=80 mm²) die area for the functional units.
So 90 mm² + 200 mm² = 290 mm² for a RV770 with 32TMUs and 640 ALUs.
A RV670 would have ~190mm² using this math.
I know very well that this small calculation is bonkers. But it shows very well that the hypothetical specs are not out of range.
If the RV6xx with no functionality would have 95mm² instead of 90mm² then a RV770 with 32 TMUs and 640 ALUs would have a dia-area of ~266 mm² (but a RV670 would have only 180 mm² using this math).
RV670 I believe also has other logic over RV635/630(or am I thinking of RV620?) and you forgot to mention that RV670 has 4x the amount RBE's. So maybe perhaps their is some more space than I thought. Although I don't picture ATi spending all that space on just shaders and texture units.