AMD = more dies = more testing & more packaging = more cost ... no ?
EDIT: Sorry, now I understand...
The yields of RV770 must be in the range of 60% ~ 80% and I use the same yields for both chips.
wafer = $5000 (let's say)
GT200: 89 dies with 40% yields = 35 good dies -> $5000 / 35 = $143 per die + testing/packaging.
RV770: 221 dies with 70% yields = 154 good dies -> $5000 / 154 = $33 per die + (2.4 x testing/packaging)
Good point... but RV770 = 2.4 x dies than GT200 -> 2.4 x more testing.
EDIT: Sorry, now I understand...
The yields of RV770 must be in the range of 60% ~ 80% and I use the same yields for both chips.
wafer = $5000 (let's say)
GT200: 89 dies with 40% yields = 35 good dies -> $5000 / 35 = $143 per die + testing/packaging.
RV770: 221 dies with 70% yields = 154 good dies -> $5000 / 154 = $33 per die + (2.4 x testing/packaging)
Wouldn't those GPU dies need to be tested anyway?
Good point... but RV770 = 2.4 x dies than GT200 -> 2.4 x more testing.
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