The revision adds a global signal for a stack ID for the high-density version of pseudo-channel mode, as well as a few other formerly unmentioned redundant signals and the method of using them, a catastrophic thermal event signal, and a few other changes.The stack height doesn't change. Both JEDEC papers describes up-to 8-dies (layers) with one channel per die (layer). Seems that several differences between "HBM1" and "HBM2" weren't related to JEDEC standard, but to manufacturers decision (in particular: manufacturing process, max. four layers per chip for "HBM1"…)
If the revision is merely a codification of what Fiji already does, then that would be fine, but if the revision is a summation of various lessons learned from Fiji and other stakeholders, Fiji's support if there is support may come with an asterisk.
The behaviors with pseudo-channel and the new stack ID signal (seems like a chip-select except for picking between two 4-hi halves of an 8-hi stack) sort of suggest that in the universe of possible implementations, HBM is starting to lean in a direction.
There's a row hammer mitigation mode, if a GPU should care, and the highest density stack comes with pseudo-channel and the stack ID signal. As an aside, Nvidia is the GPU vendor so far that has mooted planning a product that uses 8GB stacks, since they discuss a 32GB future compute product.
The prior revision has a capacity ceiling that would allow an 8GB card.Rebranding as a 8GB card with optimized PCB and/or firmware for higher clocks / lower power consumption. Something like the treatment that Hawaii got in the 290->390 transition.
Like I said before, I'm convinced that Fiji won't be replaced in 2016.
The latest HBM can take things to 32GB, and also inserts some requirements like thermal event signalling as density increases.