If the die shot Bonaire is accurate, eyeballing it makes me think half or less of the chip with 14 CUs is in the CU array.
At 180 mm2, half of that is 90. Cut that in half to get the 6 or so CUs plus some ROP area.
Maybe that puts the chip over 400 mm2?
Power consumption would be higher as well.
I think Bonaire is 160mm2. I would think it could get bigger than 400 mm2 though.
Mars includes 8 ROPs, 6 CUs, including the various dsp and specialized hardware an the memory controller it weighs 77mm2.
Anyway I think that had MSFT been that concerned with specs they would have attempted to raise the clock further. All the shipping HD7xxx card AMD has been shipping seems to overclock really well. Even with the minor overclocking it doesn't (edit forgot the negation...) seem to me like MSFT is trying real hard to close the gap with Sony.
Actually they overclocked the CPU more then the GPU.
I think the most obvious solution,had MSFT been aiming at higher performance, would have been to clock the whole thing higher (at the least the iGPU). It would burn more power but the chip is not tiny it should not be that hard to dissipate the heat (not too mention the case is huge).
I think they have a really good design and price reduction as you pointed out multiple times should go really well for them. They are not pulling a Nintendo with the WiiU 35watts but I think the "problem" (if there is really one) of the design does not seem to be on the silicon side to me but on the business one: they wanted a really silent system, etc.
Looking at AMD cards I would be surprised if an overwhelming majority of the chips that are "good" can't have the iGPU actually their iGPU clocked @950 MHz.
It means more power drawn, more heat, more noise, it seems that it is a more significant concern to then than absolute gaming performances. And they may have turned a bit "anal retentive" wrt the system reliability too ...
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Attempt to estimate the die size of the esram+ dsp
I would think that the extra memory controller (in durango) should make up for the lost CUs (assuming MSFT did not relied on coarse grained redundancy).
Now there is the two jaguar clusters which size could be extrapolate from a kabimi die shot (~).
Eye balling it, the CPU block is south of a third of the die (in kabini).
So a gross estimate for Durango with the esram, and he dsp (and some glue) should be around:
160+70= 230mm2.
That is 135mm left for the esram, audio dsp, glue/bus, etc.