of course i dont know, but i head in the post conference 200 GB/sec for sure
of course i dont know, but i head in the post conference 200 GB/sec for sure
They couldn't have upped the gpu clocks, it has been implied that the 1.2 tf leak was correct.
We should be good grateful they didn't use creative math on the computing power either, adding the server farm power up and saying xbox one has 5tflops of computing power
the 30 GB from cpu-gpu interconnection is a speculation from bkillian, we don't know how it work but they said "more than 200 GB/s system bus"
eSram is not for the system but it's only connected to gpu, so we don't know what this means in reality, here you can read only hypothesis
what about the six ops per cycle stated about the cpu core....amd cpu hasnt a so high IPC
implied where?
It's only been speculated as implied (which isn't much of a foundation to build on, admittedly); since they mentioned the 768 ops/cycle figure we know the 12CU part of the leak is correct. Hence, it may be speculated that if one part of the leak is correct then the other might be as well. Also, if clock was significantly upped, maybe they would have mentioned an actual performance metric (gigaflops) rather than just ops/cycle.you're probably just once again referencing the 768 operations thing
It's only been speculated as implied (which isn't much of a foundation to build on, admittedly); since they mentioned the 768 ops/cycle figure we know the 12CU part of the leak is correct. Hence, it may be speculated that if one part of the leak is correct then the other might be as well. Also, if clock was significantly upped, maybe they would have mentioned an actual performance metric (gigaflops) rather than just ops/cycle.
It's only been speculated as implied (which isn't much of a foundation to build on, admittedly); since they mentioned the 768 ops/cycle figure we know the 12CU part of the leak is correct. Hence, it may be speculated that if one part of the leak is correct then the other might be as well. Also, if clock was significantly upped, maybe they would have mentioned an actual performance metric (gigaflops) rather than just ops/cycle.
Adding up all bandwidth for all buses when listing system bandwidth isn't meaningful or useful. For example on a sandybridge-E based PC you have 4-channel DDR main RAM, something like 40 lanes of PCIe 3.0, dual QPI links and three levels of cache and on-chip ring bus for multiple CPU cores. Adding up all of that and I would expect total system bandwidth to hit well over a TB/s total aggregate. That's impressive as a paper spec, but that's about all it is.so that in the Xbox One would include the eSRAM, DDR3 and the CPU <-> GPU interconnect. 200GB/s for that sounds about right, i think its actually 200.6GB/s.
admitting more or less 768 shaders lets people know they have less in that area than sony too, yet they did it.
but like i said if you tell me 12cu's all but confirmed i say true. it's the clocks i'm still holding out hope for as it's not confirmed yet.
anyways any upclock will still leave them <1.8tf, so they still probably wont be super keen to talk about it even if they upclocked to 1.4 or 1.6.
and the other upclock related thing is the mention of 200gb/s bw somewhere. you can say creative maths and it may be but we dont know. it does seem a little odd if vgleaks=official ms docs, and those docs said 170 gb/s not 200, that they'd change their accounting method in some other statement.
i'm not holding out great hope mind you, just hanging onto that sliver till it's officially quashed.
The exposed die of the APU seems rather big and I don't see the eSRAM daughter die, unless that 'black' surface is really a shroud covering both.
So the die is really on the large side. The RAM chips surrounding it should be housed in standard 9x14mm BGA packages. Compared to them, the die looks to be around 19x23 mm (I just counted the pixels in Photoshop)The ESRAM is integrated into the SOC.
Cheers
So the die is really on the large side. The RAM chips surrounding it should be housed in standard 9x14mm BGA packages. Compared to them, the die looks to be around 19x23 mm (I just counted the pixels in Photoshop)
So the die is really on the large side. The RAM chips surrounding it should be housed in standard 9x14mm BGA packages. Compared to them, the die looks to be around 19x23 mm (I just counted the pixels in Photoshop)
Tim Stevens 2:25 PM
[41548] Nick is saying that "to get all of this processing out of the box" is a challenge too.The new CPU core can do six CPU operations per core per cycle, on an eight-core CPU.