DeadmeatGA
Banned
Another issue surounding the design of EE3 beside the previously discussed logic transistor density is its intense heat generation enough to make coffee and toast.
As you maybe aware, current top-end Athlons and Pentium4s are burning upto 70~80 watts of power at the peak while Power4 and Itanium2 have shot past 130 watts, requiring systems to have sufficient cooling in form of massive heat sink and fan. Now, these designs don't even have the sheer number of logic transistors that the dual-CELL cores EE3 is expected to have. Imagine all those FPUs and PPCs sucking up power to run at 3 Ghz and you are looking at one hot chip, probably hotter than any of server chips on the market. Unless SCEI puts the biggest heat sink and fan on ther market, the EE3 is not going to survive the massive heat generation and burn up.
So how will Sony be able to handle the heat generation? Slow down the EE3? Use some kind of liquid cooling technology?
As you maybe aware, current top-end Athlons and Pentium4s are burning upto 70~80 watts of power at the peak while Power4 and Itanium2 have shot past 130 watts, requiring systems to have sufficient cooling in form of massive heat sink and fan. Now, these designs don't even have the sheer number of logic transistors that the dual-CELL cores EE3 is expected to have. Imagine all those FPUs and PPCs sucking up power to run at 3 Ghz and you are looking at one hot chip, probably hotter than any of server chips on the market. Unless SCEI puts the biggest heat sink and fan on ther market, the EE3 is not going to survive the massive heat generation and burn up.
So how will Sony be able to handle the heat generation? Slow down the EE3? Use some kind of liquid cooling technology?