The second SCEI LSI in PSP

one

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According to the Nikkei NE article (reg required), the CXD1876 is a UMD signal processor LSI, while the CXD2962GG is the 90nm PSP SoC microcontroller which was disclosed at the chip conference before, so basically the PSP spec is unchanged after the memory increase. The CXD2962GG is directly connected to the external Samsung DDR-SDRAM as you see on the board.

psp38.jpg
 
Ok, so it answer the questions about the two big discrete IC present on the PSP motherboard.

The size of the CXD1 is quite surprising, i must say, it might be needed in order to help with the thermal dissipation though.
 
Vysez said:
Ok, so it answer the questions about the two big discrete IC present on the PSP motherboard.

The size of the CXD1 is quite surprising, i must say, it might be needed in order to help with the thermal dissipation though.

Apparently the UMD controller LSI was developed by the MD developers at Sony. How big is a typical DVD controller chip?
 
Vysez said:
The size of the CXD1 is quite surprising, i must say, it might be needed in order to help with the thermal dissipation though.

It's unlikely a UMD controller becomes warm to any noticeable degree. Besides, epoxy chip packages are very poor heat conductors (that's why high-power chips use flip-chip packages instead). The silicon chip inside might well be quite small, rather the chip seems to have a lot of pins instead due to its size, for some weird reason... :)
 
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