With the PS5's (external) design somewhat revealed, let's speculate about how it might be constructed INSIDE, i.e. what kind of cooling solution and airflow SONY applies.
For what it is worth, the design seems to lend itself VERY much to an application of the (through-PCB) cooling patent that was published some time ago. This way, they could actually use two heatsinks (one at each side of the main PCB) to maximise effective heat dissipation.
Here is a quick and dirty illustration of what I mean (notice that - while the XBOX Series X PULLS cool air up through the heat sink - the PS5 might very well use a fan to PUSH hot air out. Very much like the solution applied in many graphics cards - but maybe (?) improved by the use of two heatsinks that "sandwich" the main PCB):
PS: I am aware that the fan would need to be designed somewhat differently, btw (I just used the first image I found and patched it in) ... but you get the gist.
For what it is worth, the design seems to lend itself VERY much to an application of the (through-PCB) cooling patent that was published some time ago. This way, they could actually use two heatsinks (one at each side of the main PCB) to maximise effective heat dissipation.
Here is a quick and dirty illustration of what I mean (notice that - while the XBOX Series X PULLS cool air up through the heat sink - the PS5 might very well use a fan to PUSH hot air out. Very much like the solution applied in many graphics cards - but maybe (?) improved by the use of two heatsinks that "sandwich" the main PCB):
PS: I am aware that the fan would need to be designed somewhat differently, btw (I just used the first image I found and patched it in) ... but you get the gist.
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