The next version of Xbox is expected to be announced in January by Microsoft founder and Chairman Bill Gates and to be on sale next fall ahead of the holidays, according to Doherty.
Back to coding on my dual G5 and 9800 Pro...
Tuttle said:So that's what it was. I felt a great disturbance in the Force. As if a million wintel fanboys cried out in torment and were silenced at once.
[url=http://www.1up.com/article2/0 said:Pretty Decent Article[/url]]Sources said the chip powering the next Xbox will be a PowerPC, although they could not confirm which processor will power the device.
With the deal, IBM now is involved in the design of microprocessors to be used in two different next-generation entertainment consoles, each designed by two different customers. IBM, Toshiba, and Sony have each contributed to the design of the "Cell" microprocessor, which Sony Entertainment has said will be used to develop future entertainment consoles, largely thought to include the PlayStation 3.
Because of IBM's close ties with rival Sony, Microsoft probably is taking a hands-off approach to the Xbox deal, said Peter Glaskowsky, an analyst with In-Stat/MDR. "My guess is that IBM is coughing up something along the lines of one-directional transfer," he said. "Microsoft is telling IBM what will happen, and designing the machine (itself)."
Brimstone said:IBM already started to fab a revolutionary beast with the Berkeley IRAM design. With a Vector IRAM design, Microsoft would get a very high performance part, without serious thermal issues, and at a reasonable cost.
According to this page, IBM sent Berkeley completed wafers in June 2003.
http://iram.cs.berkeley.edu/chip.html
An article on the IRAM concept.
http://iram.cs.berkeley.edu/papers/IRAM.computer.pdf
Tuttle said:I don't think I every imagined I could be more blown away by a machine than my dual G5.
IBM To Power Xbox 2
Representatives from Microsoft have confirmed that IBM will be creating various chips for the next generation Xbox console. The first Xbox console uses Intel technology but the switch for the next machine is thought to be due to the lower power consumption and running temperature of IBM’s PowerPC chips.
SiS Announces Technology Development Agreement with Microsoft
~ Xbox Integrates SiS Media I/O Technologies Into Future Xbox Products and Services ~
Taipei, November 04, 2003 – Microsoft Corp. (Nasdaq "MSFT") today announced it has entered into a technology development agreement with SiS (Silicon Integrated Systems) Corp. (TSE: 2363). Under the agreement, SiS is developing advanced media Input/Output technologies for use in future Xbox® products and services.
"We're integrating SiS' cutting edge, media I/O technologies into future products to create innovative Xbox products and services that serve the digital entertainment lifestyle." said Todd Holmdahl, general manager Xbox hardware.
"The selection of Silicon Integrated Systems Corporation (SiS) by Microsoft Corporation to partner in future Xbox gaming technologies confirms the SiS track record for innovation in design and supplying leading edge technologies to the market." said Michael Chen, President and Chief Executive Officer, SiS Corp. "Microsoft's decision clearly demonstrates its confidence in SiS' ability to deliver cutting edge technologies, design & integration expertise that will be vital to future the Xbox platform."
About Silicon Integrated Systems Corp. (SiS)
Silicon Integrated Systems Corp. (SiS) is a worldwide leader in the development, manufacturing and marketing of leading-edge logic products, including core logic, multimedia, communcation and information appliance. The company was founded in 1987 in the Hsin-Chu Science-based Industrial Park in Taiwan and has been listed on the Taiwan Stock Exchange (TSE2363) since August 1997. SiS combines professional chip design with advanced semiconductor manufacturing technologies. For more information, please visit www.sis.com.
london-boy said:i knew it.... Always thought IBM and ATi would make a mountain of cash from the next gen consoles.......
McFly said:So it is:
CPU: Power PC
GPU: ATI
In/Out chip: SiS
Fredi