Dominik D
Regular
I think this hasn't been discussed before:
http://news.softpedia.com/news/TSMC-Sees-Increased-Demand-for-the-28nm-Process-Node-236571.shtml
It states that TSMC's current wafer output is around 20k/mo and that this should increase to around 100k/mo in 2012 (300mm wafers) with 28nm-oriented Fab 15. Customers at this point are AMD, Nvidia, Altera, Qualcomm and Xilinx with Broadcom, LSI Logic and STMicroelectronics rumored.
So for, say, 200mm^2 per chip their peek expected capacity in 2012 would be 306 dies per wafer so 30,6 mil chips per month assuming 100% yield (which won't happen, obviously). I think it's fairly reasonable to expect TSMC to produce chips for 2012 console if their plans and estimations are doable.
Oh, I have a question too. What is a "typical" yield in, say, first and fifth year of production? Is it more like for example 30% to 90% or is it something better (or worse)?
//edit
NVM, got my Q answered: http://bnrg.cs.berkeley.edu/~randy/Courses/CS252.S96/Lecture05.pdf
http://news.softpedia.com/news/TSMC-Sees-Increased-Demand-for-the-28nm-Process-Node-236571.shtml
It states that TSMC's current wafer output is around 20k/mo and that this should increase to around 100k/mo in 2012 (300mm wafers) with 28nm-oriented Fab 15. Customers at this point are AMD, Nvidia, Altera, Qualcomm and Xilinx with Broadcom, LSI Logic and STMicroelectronics rumored.
So for, say, 200mm^2 per chip their peek expected capacity in 2012 would be 306 dies per wafer so 30,6 mil chips per month assuming 100% yield (which won't happen, obviously). I think it's fairly reasonable to expect TSMC to produce chips for 2012 console if their plans and estimations are doable.
Oh, I have a question too. What is a "typical" yield in, say, first and fifth year of production? Is it more like for example 30% to 90% or is it something better (or worse)?
//edit
NVM, got my Q answered: http://bnrg.cs.berkeley.edu/~randy/Courses/CS252.S96/Lecture05.pdf