Panajev2001a
Veteran
Also, even staying at 90nm, the diffrence in die sizes between the ~2000 launch ICs and todays EE+GS is huge, it's mind-boggling to me how Microsoft wants to compete in the long-term using 3rd party ICs. If SCE keeps this up, they're going to bend MS over so badly on their economies of scale and bottom-line profits.
Infact it would appear that SCE/Toshiba are kicking much of the industries ass in scaling the lithography down. They've definatly beasted the Tiawan based founderies.
This is one of the key-points of Sony's strategy: Microsoft has a lot of money in the bank and it is approaching the industry with the wallet wide open and not much regard for cost efficiency ( the Xbox is STILL loosing quite a bit of money for each unit sold while PlayStation 2 has been profitable for a while now ) and Sony plans to keep attacking them on the manufacturing size by pushing the manufacturing costs down as much as it can thanks to the good R&D job that keeps on researching new manufacturing technologies.
Sony plans to have Microsoft outspend them each time trying to catch up or surpass them and with Microsoft policy of using 3rd party produced chips, Microsoft cannot drive the costs down as fast as Sony can...
Sony knows they have less money in the bank than Microsoft and that is why they are playing it smart and aggresively.
Sony as a semiconductor manufacturer is gaining lots of experience from their alliance with Toshiba on PlayStation 2 chips and with IBM and Toshiba on PlayStation 3 chips which is good for all three companies