If it is, it doesn't show it in the datasheet. I'm not seeing any additional FUs here or extra scheduling logic, pipeline stages, etc, that might account for a difference. Since "50% more logic" is your theory, one would think you might do the leg work and read the datasheets for both the 750CL and 750CXe to compare -- since the answer is literally right in front of you. I think all of the reasons I've given are far more valid (less than 50% reduction in die size from new process, fan-out on such a small core), not to mention the fact that this 11 sqmm figure is a made-up number and is in all likelyhood inaccurate.
Its not as easy as looking through the data sheet for the 750CXe and 750CL to find the differences. Because Gekko was already different from 750CXe and its never easy to see the differences in two different data sheets to begin with. By the way, 11mm^2 is in no way a made up number..
It will be close to that, but you are talking about the average feature size, so it's not going to be exact depending upon the chip. I'll be honest and say that I can't even believe people are disputing IBM's datasheet because someone's die estimate was off by 5 sqmm.
You keep talking about a 5mm^2 difference as if its so small as to be insignificant. If you where talking about CELL then it would be, but when your talking about a CPU which should only be 11mm^2 in the first place its anything but.
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