ATI RV740 review/preview
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Geez guys I can figure figurative Chinese, being a rather sleek lurker in forums and such.
Stop with the machine translations, it's killing me with lethal laughter
汗 - the chinese equivalent of "sweating" - aka speechlessness. Nothing about Genghis Khan LOLLLLLL
Stop with the machine translations, it's killing me with lethal laughter
汗 - the chinese equivalent of "sweating" - aka speechlessness. Nothing about Genghis Khan LOLLLLLL
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The chinese-english dictionary i have been using gives that symbol as "hàn"(pronounced similarly to khan in english) with 2 definitions perspiration/sweat or "king/emperor"
What about the second - 死 - pronounced " sǐ "
That means "to die or impassable or rigid" doesnt it?
I saw that the first char was also sweating but the rest of the sentence didnt fit how do you get "sweating /speechlessness" together with "rigid"...suppose could mean catatonic or similar but totally didnt fit with the rest of the sentence.
So should i throw out my dictionary?
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Yes if you have manual workmanship then these 100ppm looks like rocket science problems. But AMD developed APM and GP willingly announced that they sold that knowledge to anyone pays enough
Your quote is not relevant in this context. The problem that AMD had to solve at that time, was yield. As indicated earlier, this is very coarse problem and something for a fab to solve.Yes if you have manual workmanship then these 100ppm looks like rocket science problems. But AMD developed APM and GP willingly announced that they sold that knowledge to anyone pays enough
When talking about ppm, it's about test coverage and not letting failed devices being declared as good. That's a different problem. The difference between 500ppm and 100ppm is in the noise wrt yield and not of any concern for the fab, but it's very important for the fabless company who's selling the devices to the downstream customer who integrates the chip into an actual product. APM wouldn't solve any of that. What you need it such a case is a very comprehensive DFT strategy and a willingness to incur the cost of much longer test times.
Ah ok so sort of similar, "khan dies" to "god damn"...well at least i know how to swear now.
The above looked simplest to translate, There was one other more difficult sentence to translate, am very hesitant about this after difficulties above. Anyway just for laughs:
Which is something like:hotboy said:
Boss came yesterday, no time to turn around, according to reliable report 2 new cores to leap, also not surprising student with disabilities has birth defects.
ie Boss came by yesterday to report amd has 2 new cores. RV740 is "student with disabilities" as it was designed to learn about 40nm and is a cut down RV770 having "birth defects" ie high early failure rate.
Am presently burying my dictionary in the backyard, I can see tchock laughing now....
Boss came buy yesterday, so I didn't have time to reply. According to a reliable source we're going to produce 2 new cores "a jump / on a new level" some time ago they produced a "handicaped" core.
Indeed rjc, as I read it here AMD willingly mutilated and basically neutered RV740 to adapt to a troublesome 40nm process. So even though yields might be low it seems to be a salvage part in general. From that point of view, getting your first revision (A11) out the door and with a good market reception while actually producing it as a test processor is quite a feat.
Well apm seemed to me as ongoing process. Maybe 1.0 was only an yield oriented but from above it more look alike whole automated binning and testing process even in this 2.0 stage. Anyway that DFT-Design for Test? you mentioned ... silicon testing ground. And the whole APM thing i mentioned cause someone above point out year old news about speculative TSMC venture into chip packing and testing, and there was much rumors what know known Globalfoundries corp will look a like before they close the deal with ATIC. GF is mor than willing to JV with TSMC for their cash inflow to build some TSMC testing ground round their APM 3.0 or more what they now blabing about beneath the carpet.
Thankyou again neliz for checking the translation. Dont get too caught up in the RV740, the main part: "2 new cores in production of a new level" is kindof a bit important too.
Thing is that quote was less than a month ago, provided everything works smoothly(admittedly a really big assumption) amd should have production quantities of 2 new chips in a couple of months or so.
Question then becomes, what are they announcing this week? Announcing these 2 cores now will likely have a detrimental effect on sales of current products as happened to the RV770 when the RV740 was introduced.
2家的新核 - cores from the 2 IHVs, btw.
it's referring to "RV870"/Evergreen and GT300 being tremendous leapfrogs over their current lineups.
But gosh, you guys do have the effort.
I have to say sadly though, that Chiphell wasn't the place it used to be. Still fun to hang out, but not really that robust in info anymore. There are a few informants, but basically only their threadstart posts matter- the replies are mostly BS.
it's referring to "RV870"/Evergreen and GT300 being tremendous leapfrogs over their current lineups.
But gosh, you guys do have the effort.
I have to say sadly though, that Chiphell wasn't the place it used to be. Still fun to hang out, but not really that robust in info anymore. There are a few informants, but basically only their threadstart posts matter- the replies are mostly BS.
Or is it lacking in stock because RV740 launched in China on the 28th of May, thus taking away stock intended for other markets?
China is crazily price sensitive (on top of REALLY rigid graphics pricing with SKUs coming in at every 100-200RMB level) compared to the other markets which would make RV740 an easier sell while replacing RV770LE/4850 would sell in the others still.
China is crazily price sensitive (on top of REALLY rigid graphics pricing with SKUs coming in at every 100-200RMB level) compared to the other markets which would make RV740 an easier sell while replacing RV770LE/4850 would sell in the others still.
Hmmm, i never seem to be able to get this right. When i do it by hand:
- 2 - 2
- 家 jiā - family
- 的 dí - really
- 新 xīn - new
- 核 hé - core
- 又 yòu - again
- 是 shì - to be
- 一次 yī cì - first
- 飞跃 fēi yuè - to leap
For some reason i thought "family" was 2 market segments(ie like performance, mainstream, entry etc). Didnt occur to me at all was 2 families "nvidia" and "amd".
The "..again to be first to leap part" seemed to suggest whoever got to the previous node first was going to do it again.
Very frustrated at the moment
Thanks - sorry to put you through all this, i wish i was better at translation, it's so hard to get the right meaning.But gosh, you guys do have the effort.
Ok will bear that in mind in future, thanks again for helping me with this.I have to say sadly though, that Chiphell wasn't the place it used to be. Still fun to hang out, but not really that robust in info anymore. There are a few informants, but basically only their threadstart posts matter- the replies are mostly BS.
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