Mobile shit is shit.Samsung and Micron have stacked memory initiatives.
I think it's pretty obvious that they will make that move, fast L3 or not. The same goes for APUs, those have even more to gain from seperate high bandwidth memory for the GPU part.Intel is rumored to be looking into using a silicon interposer for a CPU.
OK I'm gonna say it, "console"
OK I'm gonna say it, "console"
OK I'm gonna say it, "console"
I think anything tagged with "far future" should be 28nm (or below but I can't see how they could get a prototype with below).That's what I thought too. We already know the Wii U has an AMD GPU, but it's a kind of RV770-ish thing, and this looks bigger (assuming 40 nm or smaller).
So maybe the next Xbox or Playstation.
The site appears down... does anyone mind explaining the general design of the interposer to me? (From what I can gather from this thread the link has info about kind of chip-to-chip interface, possibly some stacked memory?)
It's simply a new form of multi-chip-module, but instead of using a glorified PCB to put the chips for the module on they use another HUGE chip (made in an older process to keep costs down).The site appears down... does anyone mind explaining the general design of the interposer to me?
If you're a GPU maker, what features of DRAM as we currently know it, are desirable in a memory subsystem enabled by an interposer?Which DRAM manufacturer would be ready to invest in GPU memory optimized for silicon interposers or stacking though? For mobiles I can see one of them stepping up to the plate, GPUs ... dunno. Without Qimonda I doubt we would have even had GDDR5 and we know what happened to them.