Not sure why you think that this results in loss of development capacity. As for what the JV does or does not do in the future depends on what they develop, however there are multiple packaging facilities outside of AMD or this JV that are already used across the semi industry and there are articles already out there that point to ASE and Amkor for Fiji packaging.OK but why did they need a packaging department even before this announcement when they work closely with Global Foundry?
What have they been doing that could not be done since they sold off GF?
AMD has been fabless for a long time or was it only partial?
Sorry for another post,
just to emphasis my focus was specifically Multi-Chip Modules and stacked dies, rather than the whole lot in terms of fabless packaging department.
So we assume the new joint venture is doing all of this as well for their current operations and business/done with GF/mix of both?
Cheers
Last edited: