Glad to see there's enough space for a M.2 SSD and a generous heatsink. That should increase the number of high-speed SSDs we can use for expansion.
So we're looking at confirmation of the sandwich heatsink patent, right?
This is the heatsink sitting in the opposite side of the SoC, item 21 in the patent picture:
And here are the copper contacts we see in the patent, item 11 in the patent:
Now, IIRC the patent also describes item 5d as being stacked memory.
If there is stacked memory on the bottom of the SoC, there could be some meaning to putting the GDDR6 chips in the bottom of the PCB.
I'll try to find the patent text and then I'll update this post.