Here is, what's hidden under the hood of the latest G200-302 batch:From a newer XFX XXX:
... so it seems there is a better version of GT200A out, since usual GTX 280 an older XXX used G200-300-A2?
Still no 55nm in there.
Here is, what's hidden under the hood of the latest G200-302 batch:From a newer XFX XXX:
... so it seems there is a better version of GT200A out, since usual GTX 280 an older XXX used G200-300-A2?
Well, actually it looks exactly like that 'mystery chip' i've posted a month ago and as far as i can tell from this photo it's not 578mm^2 either...Still no 55nm in there.
But some of that is inter-die waste isn't it?In fact, the die-count on the 300mm GT200 wafer suggests an area, larger than the officially announced 576 sq.mm, anyway.
If you're going to link something, at least link the original article that's sourced:
UPDATE: Picture that accompanied the story did not feature GT206 chip, thus I removed it. The rest of the info is pretty valid
If you're going to link something, at least link the original article that's sourced:
http://theovalich.wordpress.com/2008/11/11/55nm-gt206-gpu-powers-both-gtx290-and-quadro-fx-5800/
where we see the following addendum:
Jawed
The space between dies ("scribe") is between 100 and 200 um wide.How much area does the sawing of a wafer into individual dies consume?
So about 1% of the area of GT200's die.The space between dies ("scribe") is between 100 and 200 um wide.
thus designing a entirely new chip about to be replaced by GT206 and GT212. There's a reason half-node re-releases are also called an optical shrink, and it's the same reason they make save money.
Power usage is also critical for the market where quadro and tesla sells, whereas most high end gamers don't care.