Depends on what we're talking about.TDP is pretty much meaningless with out knowing the amount of chip area the heat is spread over.
At the end of the day, if chip consumes 800W and is either one square millimeter or 100 square millimeters, it's still 800W of heat that needs to be relocated to the surrounding air. The density of that heat matters for proper heatsink development and materials science (ie make sure the chip itself doesn't burn up from that power), yet it's all still just heat. The heatsink could be a 12" forged aluminum pan with four tablespoons of butter sizzling in it, ripe for a 16-ounce bone-in well marbled 2" thick dry-aged ribeye to stop in for ~90 seconds on each side to get to a fancy crispy outer crust and a warm medium rare on the inside.
You could obviously construe an argument where the chip is the size of a picnic table and thus 800W becomes somewhat pointless. That's also a logical fallacy as the chip sizes we're talking about are constrained to the reasonable size of an ATX-compatible PCB mounting scheme