No naked Euro PS3 piccies?

[Rainbow Man]

I can't believe nobody's done a striptease of an euro PS3 and posted up nudies on the web yet.. That's really disappointing.

We need a hardware teardown now to check for changes! Who voulenteers?
Pecae.

 

[NERO]

I was under the impression that the board layout would be identical to US/Japan sans the EE. Maybe Sony finally snuck in the G80 (Is that the constipation icon?)

 

[Simon82]

I can't believe nobody's done a striptease of an euro PS3 and posted up nudies on the web yet.. That's really disappointing.

We need a hardware teardown now to check for changes! Who voulenteers?
Pecae.

http://www.hwupgrade.it/articoli/vi...station-3-la-next-gen-e-adesso-part-1_10.html

Credit to www.hwupgrade.it one of the best italian hw related site.

 

[Shifty Geezer]

For comparison, Japanese release

http://pc.watch.impress.co.jp/docs/2006/1111/ps3_32.jpg

Euro release

http://www.hwupgrade.it/i.php?img=Componenti6.JPG

The Euro board is even tidier!! The controller chip (suspect SCC) is smaller. It's about 90% of the Cell BBE in the Japanese mobo. It's about 55% of the Cell BBE size in the Euro board. 65nm component?

 

[Fu3lFr3nzy]

The 2nd image is giving me some error Shifty

 

[JardeL]

...

 

[inefficient]

Some observations

Orig RSX: CXD2971GB
New RSX: CXD2971DGB

Orig Cell BE: CXD2964GB
New Cell BE: No Change

Orig XDR Samsung K4Y50164UC-JCB3
New XDR ELPIDA X5116AC-3C-E

Orig HDMI Transmiter: Si19132CBU
New HDMI Transmiter: No Change

Orig *SCC CXD2973GB
New *SCC CXD2979GB
*Only rumored to be the SCC


It seems EU did not get the revised 90nm Cell processor yet. For the moment it's identical to the US/JP one. RSX got some kind of minor revision. They totally went went with another vendor for the XDR.

 

[Shifty Geezer]

What sorts of revisions might RSX get? Just a layout change for costs/efficiency/etc.? They can't muck about with the workings.

And is the 'SCC' shrunk because it's 65nm, or it's a reduced part?

 

[inefficient]

What sorts of revisions might RSX get? Just a layout change for costs/efficiency/etc.? They can't muck about with the workings.

They might have just changed the DRAM. If you remember the dram is on the same packaging as the GPU.

 

[Capeta]

They totally went went with another vendor for the XDR.

Which is nothing to write home about. Using multiple suppliers for parts is common expecially when it comes to memory. It has also been mentioned a LONG time ago that Elpida would be co-supplying XDR.

 

[Shifty Geezer]

Someone needs to crowbar off a couple of heat-spreaders...

 

[Crossbar]

Some observations
...
Orig *SCC CXD2973GB
New *SCC CXD2979GB
*Only rumored to be the SCC
.

Some additional observations made from these pics and this document:

The new "SCC" is considerbly smaller than the old one maybe they trimmed off some redundant logic from the standard "SCC" or they've done a die shrink.

They have moved around some components close to the "SCC" and they now have two flash chips on the front side of the PCB because they removed the one on the back side.

 

[Crossbar]

From the PCB layout one can see that the "GS" chip is connected to the RSX. I wonder if that means the connection to Cell goes via the RSX and not via the southbridge chip as been speculated.

What is the bandwidth of the bus connecting the EE and the GS in the original PS2?

 

[archie4oz]

1.2GB/s

 

[Crossbar]

1.2GB/s

Thanks!

Some of the lines between the RSX and the GS on the front side are rerouted lines that previously didn´t go via the GS, but there are a few new ones on the front side and over 50 new lines on the back of the PCB, that previously probably were hidden inside the board in the old board revision.

I think that these things indicate that if the GS will be integrated into some other circuitry later on it will likely be the RSX and not the south bridge.

Another thing that strikes me is that the GS chip is so big and it looks to be a multichip package. Couldn´t someone peel of the plastic package and reveal the inside?

Is this the hidden power of the PS3? :smile:

 

[Shifty Geezer]

Another thing that strikes me is that the GS chip is so big and it looks to be a multichip package.

Isn't that just because of the number of pins needed? No matter how small the die, you still need to plug the chip in, and hundreds of pins (384 from a Google) can only be shrunk so small.

That's my guess.

 

[Crossbar]

Isn't that just because of the number of pins needed? No matter how small the die, you still need to plug the chip in, and hundreds of pins (384 from a Google) can only be shrunk so small.

That's my guess.

Yes that may be part of the reason for the size of package even if I doubt they would need to have the same number of pins of the design of today.

The new GS should be a fairly small chip at 90 nm.

Something like 30-40 mm2 seems likely. If someone could peel off the plastic we could have that confirmed.