Vita had stacking [but with side bridges, no vertical bandwidth paths to two 256MB RAM chips and one 128MB VRAM chip]
Next Generation Hardware Speculation with a Technical Spin [pre E3 2019]
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Vita had stacking [but with side bridges, no vertical bandwidth paths to two 256MB RAM chips and one 128MB VRAM chip]
Huh? What's replacing them?
anexanhume
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More Navi rumors
Tkumpathenurple
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I think he means that sailors find them delicious.
NUSA, non-unified shader architecture?
Frenetic Pony
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That was fantastically unhelpful. There's some sort of guide, that then doesn't seem to correspond at all to what I'm looking at? I don't know how you got 1.8ghz out of that thing, what am I missing? : (
To me, most notable thing from this is that Navi will be spiritual successor of Polaris [which was price/performance king of its time], that it will skip the biggest mistake of Polaris [who had it high performance part canceled due to belief that Vega+HBM could replace it], and that it will be focused on GDDR6.
All that sounds good.
If this summer Navi 10 is close to 2070 for much cheaper price, I will be glad.
Unhelpful ? In what sense ? He (Apisak) said he is just guessing the gpu clock.... thats why there is question mark.
The point was that the code name "Navi Lite" is connected with conzole and that APU will use 8 zen cores
Like he said in other tweet, just guessing. Only "confirmed Navi" (really just confirmed console APU) is the Gonzalo and only speed that particular leak suggests, if any, is 1 GHz
That places many layers of material between the active silicon and the heatsink. I am not sure if you meant PCB as in the motherboard, that's several layers of insulation, then the layer of solder balls for the chip package, then multiple layers of the package, then the interposer, then the base area of the stack.
There is some heat transfer capacity for a chip through its traces into the motherboard, for a limited amount of dissipation. That tends to track with limited power consumption and a sufficient ratio of connected traces in the PCB.
HBM's distance from the board is greater, and more of its smaller connections provide don't go very far since they're in the interposer and go straight to the SOC.
If you meant getting the heatsink up to the base of the chip package or up to the base of the interposer, it might be closer. Wires need to be routed around it, pad area between each layer needs to be sacrificed, and the mechanical properties shift. The amount of transport and how well it would turn out in models or implementation is outside of my sphere of expertise.
The small cross section of the wires and distance traveled seem like they would limit the dissipation through the wires. The underside heatsink patent put much more metal through the PCB and package to the chip in order to provide a lower thermal resistance path.
Most likely 1 core [2 threads] will be for OS, and few gigs of ram [hopefully that will be slow ddr like on Pro's mobo].
Tkumpathenurple
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12TF doesnt mean its great either. 7TF of turing might be enough.
But they're not with Nvidia so it's redundant. Although 12TF of Navi with far better efficiency than Vega could be a game changer.
PCI ID 13E9 reffers to NAVI Lite
Rootax
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Well, given how zen+ cores are much more capable than jaguar core in todays console, I still think it's a big, big boost, very needed, even of "only" 7 cores are really available, maybe with smt in top of that.
And I don't want to pay my PS5 699€ because of 2 more cores
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