I see AMD hasn't mentioned how they're going to handle the memory problem.
If we want more than mediocre graphics performance, the GPU portion of Fusion is going to need maybe 40-100 GB/sec. It might need more, depending on what happens by 2010
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A GPU could likely tolerate a few hundred nanoseconds of memory access latency, while CPUs right now like an average best case of less than fifty. For better performance, future CPUs may be fighting to get the latency even lower.
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Rather, it's going to need an order of magnitude more bandwidth and record-low latency.
In papers presented at the International Solid State Circuits Conference, IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (Embedded Dynamic Random Access Memory). IBM's new microchip technology will more than triple the amount of memory stored on chips and double the performance of computer processors. It will be available in 2008.
http://www.physorg.com/news90661936.html
IBM today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore’s Law beyond its expected limits. The technology – called “through-silicon vias†-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
http://www.physorg.com/news95575580.html
Earlier this year AMD and IBM signed an agreement about collaboration in development of on 65 and 45nm technologies to be implemented on 300mm silicon wafers (
see this news-story). Under the terms of the agreement AMD and IBM will be able to use the jointly-developed technologies to manufacture products in their own chip fabrication facilities and in conjunction with selected manufacturing partners. Both IBM and AMD will produce chips using advanced SOI technology. In January we were told that IBM may also manufacture CPUs for AMD. Moreover, according to AMD plans, it intends to begin manufacturing its 65nm process on 300mm wafers in the second half of 2005 and the company was looking for a partner in the manufacturing facility that will produce 300mm wafers (
see this news-story). Well, maybe AMD has already found this partner.
http://www.xbitlabs.com/news/cpu/display/20030512040641.html
AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45nm Chips
http://www.physorg.com/news85247225.html
The vacuum technique, called Airgap, will be introduced to IBM's manufacturing process with the 32-nanometer generation of microprocessors, said IBM fellow Dan Edelstein, who led the project. These chips will start rolling out in 2009. IBM's semiconductor partners--including Advanced Micro Devices, Toshiba, Sony "and soon to be others"-- will be able to adopt the technology for their own chips, he added.
http://news.com.com/2100-1008_3-6180994.html
Agreement Now Includes Research and Development of Submicron Process Technologies through 2011, Adds Early-Stage Research on Critical Emerging Technologies Targeted at 32 and 22 Nanometer Generations
AMD today announced it has broadened the scope of its technology alliance with IBM. The expanded alliance now includes early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through 2011.
http://www.physorg.com/news7810.html
Will AMD benifit.. I think so.. Cause without IBM ,,, AMD is toast against INTEL'S R&D group.. TOAST!