Soo, anyone wanna take a shot at die size?
(also which Xe GPU is it?)
It's lacking detail, at an angle and the reflection is pretty intense, but I think I see a few features.
There are horizontal bright bands at regular intervals, with the most obvious being right next to the thumb. I think the next repeats of this pattern are: about in the reflection of his glasses in the upwards direction, and above the base of the thumb in the downwards.
Repeating this pattern and trying to connect possible regions of similar appearance yields maybe two more such divisions in the upwards direction.
There are vertical stripes that show up more like gaps in the pattern that might match cut lines. I think the first is about a thumb-width to the right of the edge of the wafer, and attempts at connecting the dots between regions on the left half of the wafer show 6 or 7 such lines on that half.
Whatever's left of the leftmost division or above the topmost line would probably be waste.
I think it's about 6.5-7 such columns for the left half of the wafer, and 4-4.5 rows in the top half.
I'm presuming the radius of the wafer is 150mm, so this sort of squinting + MS paint gives ~22mm x ~33mm rectangles with massive error bars.
That's a big die, if those lines were the last word. There is a periodicity to those bright horizontal lines, so something is repeating at least that often, but they might not be a die boundary or not the only one in that direction.
Perhaps this can be cut more in the vertical direction more, as there's more horizontal regions that I cannot tease out the significance of, versus the more distinct vertical lines. If for example the vertical regions are two dies whose other cut is indistinct, it would be a more modest though still substantial die.
It's possible the visual fidelity is so poor that compression artifacts or my eye are introducing lines where there aren't any or hiding others, however.
The multi die strategy will meet much more success in compute or AI, though at 500 watts it seems their architecture have terrible efficiency.
The story's table indicates the 400/500W board is a 4-tile device. On a per-tile basis that doesn't seem bad, depending on how much is in a tile.
That power requirement and 48V delivery does rule out consumer products. Perhaps an HPC or datacenter custom module?