Why can't we say for example that a 7950GX2 is 512-bit ?
What's the difference btween a dual GPU (2x256bit) and a single GPU (512-bit) ?
Thank you
The fact that the 7950GX2 is comprised of two discrete chips with their own discrete memory buses/banks. GPU1 can't access GPU2's memory, nor is the reverse possible. Thus, you don't get a double wide bus, but 2 parts with individual busses that exchange a limited(relatively) ammount of data through the on-board PCI-E interconnect. The future MCM multi-GPU solutions may change that-the scenario would be a number of discrete cores linked to a central "hub" that arbitrates memory access, among other things, through a single-unified and probably rather fat memory bus. Time will tell.
As you can see it ever since the AMD Athlon 64 days (and soon, in Intel's "Nehalem" too), the practice of using a centralized, external memory controller (motherboard chipset's Northbridge), shared between CPU's/cores through a "fat bus" (Front Side Bus) has been deemed as being largely inefficient.
Why should it suddenly become appropriate in the GPU realm now, where speed is paramount ?
Would ATI revert two steps back, after developing a sophisticated ring-bus internal memory controller, to an off-die shared controller ?
I can't make any sense of it, as they are two technological moves in clear contradiction of each other, IMHO.
Agreed.I can't make any sense of it, as they are two technological moves in clear contradiction of each other, IMHO.
Agreed.
I suppose it's worth pointing out that GPUs, via either AGP or PCI Express (PCI too?) have access to CPU memory. HyperMemory/TurboCache are the marketing names in the PCI Express view of the world:
http://techreport.com/articles.x/8396/1
Jawed
Perhaps I worded it badly, and comparing the FSB with what an external 512-bit bus to memory is quite a stretch, ignoring the frequency of the GDDR attached to it which would be far beyond the measely thing you can get with typical DDR2 modules tied to a dual-channel 128-bit interface. Someone had a nice drawing in the R700 speculation thread that pretty much illustrated a possible arrangement for this, think something like 4 chips in the corners of a square with the "arbitrator" at the diagonals' intersection. This way all chips have acces to all of the RAM that's onboard, they don't have to go through each-other, tracing is easier that tracing 4 individual 256-bit buses to the MCM, scaling is easier.
Yes, i'm well aware of them.
But using system RAM is neither desirable nor efficient for realtime 3D graphics rendering, otherwise IHV's wouldn't develop wide internal buses with lots of dedicated video RAM.
A good example is the recently disclosed AGP8x version of Powercolor's HD3850 512MB.
Given similar systems (as possible), would it really make any difference going from AGP8x to PCIe 1.x to PCIe 2.0 ?
I don't think so.
Even with "efficient on-package tracing" (physically similar to the ones used -in single GPU configurations, of course- in stuff like Nvidia's RSX or ATI's Xenos) it would still be an external/off-die memory controller, there's no way around it.
As for comparing GDDR types with DDR, i never mentioned anything of the sort, although i do have to point out that there is, in fact, DDR3 @ 2000MHz (not GDDR3, mind you).
This despite the fact that it's a DIMM-type of RAM, not an bunch of IC's soldered directly next to the dedicated path like in a graphics card.
What would you suggest as an alternative?The proposed scenarios imply up to 4 individual GPU dies on a single package. Should each die include its own memory bus and have it's own discrete VRAM pool, maintaining the inneficiencies of current solutions?Something else?Honest question, I'm curious WRT how ppl are seeing the possible(probable) future implementations of multi-GPUs.
Oh yes , thank you!!
One more question
What's the difference between a dual gpu in 2 pcbs and a dual gpu in only one pcb (like 3870 x2) ?
Aestethics(in theory, going single PCB could mean shorter traces/better inter-GPU communication, but both nV and ATi have opted to use a bridge chip anyway to handle interchip communication so that's irrelevant for this gen). You could also make a case for the dual-PCB board being harder to cool/a bitch to get aftermarket cooling on, but I don't think that was the point of your question