According to the numbers I saw in anandtech's articles, it's 50% reduction 28>16FF; 50% 16FF>
10FF; >37% 10FF>7FF; 10-20% 7FF DUV > 7FF EUV.
http://www.anandtech.com/show/11337/samsung-and-tsmc-roadmaps-12-nm-8-nm-and-6-nm-added
What are you calling 7nm+? Is it 7FF EUV?
It seems that everything below 7nm will need to use Extreme UltraViolet lithography:
http://www.anandtech.com/show/10097...-good-progress-still-not-ready-for-prime-time
And the 7FF DUV we're seeing from TSMC and GF will actually be more like a half-node (more like three quarters node?) between 10FF and 7FF EUV, given the possible area reduction between DUV and EUV.
Regardless, any console chip that pursues the best possible lithography will need to use EUV, starting in 2020 or so.