Isn't that what I said, essentially?
The reduction in die size usually leads to increased yields (due to more dies per wafer), lower power consumption (usually, power seapage was, hopefully, taken into account on conception of the GPU), and lower heat output is a given. Those are all pretty much the core reasons for reducing die size, that, and increasing clock speed. None of the points either of us mentioned are mutually exclusive.
So, I'll assume you agree with me and just had a funny way of saying it
No because i think this
I think there is a decent chance that it will be an 'upgraded' G70.
isn't true. It will just have the proper support for cell and accessing the xdr ram .
On 110nm the 6800ultra at 400mhz requires two power connectors and consumes alot of power and produces alot of heat . The g70 on 110nm will require more power and produce more heat . The g70 on 90nm should reduce this but to what extent ?
With the drop in micron process we are also increasing the clock speed of the chip .
I think what we are going to see is 90nm used for getting the gpu as cool as possible , getting it to use as little power as possible and getting its yields as high as possible
I don't see them upgrading it at all. Adding more pipelines or other features will increase the power draw and heat output .
This is imo of course